Abstract
To achieve precise, hermetic, and reliable optoelectronic packaging, we studied a novel technology for bonding fibers to v-grooved chips by metallic soldering. Multilayered metallization of Ti/Au, Ti/Cu/Au, or Ti/Ni/Au has been prepared to improve the poor bonding nature of solder on oxide surface. The eutectic 43Sn57Bi (wt.%) alloy, having a melting point of 139°C, was selected to bond the fibers to v-grooved chips. The alignment and adhesion tests result show that the precision packaging by soldering has a satisfied reliability in the range of working temperature from −40°C to 85°C. The metallic solder bonding is hermetic, and hence, it can isolate the optical device from ambient environment.
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Ou, S., Xu, G., Xu, Y. et al. The application of lead-free solder to optical fiber packaging. J. Electron. Mater. 33, 1440–1444 (2004). https://doi.org/10.1007/s11664-004-0084-z
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DOI: https://doi.org/10.1007/s11664-004-0084-z