Skip to main content
Log in

An Experimental Study of Fracture of LIGA Ni Micro-Electro-Mechanical Systems Thin Films

  • Published:
Metallurgical and Materials Transactions A Aims and scope Submit manuscript

Abstract

This article presents the results of an experimental study of fracture in LIGA Ni micro-electro-mechanical systems (MEMS) thin films. Microtesting techniques are developed for the study of the J-resistance curve (Ja) behavior in compact tension (CT) thin film specimens. In-situ measurements of crack-tip strain are presented together with in-situ and ex-situ microscopic images of crack-tip deformation and fracture mechanisms. Fractographic observation showed a mixture of inclined fracture planes (slant fracture) that are relatively featureless and normal fracture planes that exhibit dimples and microholes resulting from plastic deformation.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11

Similar content being viewed by others

References

  1. M. Mado: Fundamentals of Microfabrication, 2nd ed., CRC Press, Boca Raton, FL, 2002

    Google Scholar 

  2. T.E. Bucheit, D.A. Lavan, J.R. Michael, T.R. Christenson, S.D. Leith: Metall. Mater. Trans. A, 2002, 33A:539–54

    Article  Google Scholar 

  3. M. Strobel, U. Schmidt, K. Bade, and J. Halbritter: Microsyst. Technol., 1996, ser. 1, vol. 3, pp. 10–16

  4. T.L. Anderson: Fracture Mechanics: Fundamentals and Applications, CRC Press, Boca Raton, FL, 1991

    Google Scholar 

  5. M.F. Kanninen, C.H. Popelar: Advanced Fracture Mechanics, Oxford University Press, Oxford, United Kingdom, 1985.

    Google Scholar 

  6. J.R. Rice: J. Appl. Mech., 1968, 35: 379–86

    Google Scholar 

  7. C.L. Hom and R.M. McMeeking: in Analytical, Numerical, and Experimental Aspects of Three Dimensional Fracture Processes, A.J. Rosakis, K. Ravi-Chandar, and Y. Rajapakse, eds., ASME AMD-vol. 19, ASME, New York, NY, 1988, pp. 215–26

  8. T. Nakamura and D.M. Parks: in Analytical, Numerical, and Experimental Aspects of Three-Dimensional Fracture Processes, A.J. Rosakis K. Ravi-Chandar, and Y. Rajapakse, eds., ASME AMD-vol. 19, ASME, New York, NY, 1988, pp. 227–38

  9. R. Narasimhan, A.J. Rosakis, and A.T. Zehnder: in Analytical, Numerical, and Experimental Aspects of Three Dimensional Fracture Processes, A.J. Rosakis, K. Ravi-Chandar, and Y. Rajapakse, eds., ASME AMD-vol. 19, ASME, New York, NY, 1988, pp. 239–53

  10. W. Li, T. Siegmund: Eng. Fract. Mech., 2002, 69:2073–93

    Article  Google Scholar 

  11. Annual Book of ASTM Standards, ASTM, Philadelphia, PA, 1987, ser. 1, vol. 3, pp. 1129–45

  12. A. Nagy, J.B. Campbell, D.L. Davidson: Rev. Sci. Instrum., 1984, 55:778–82

    Article  Google Scholar 

  13. D.R. Williams, D.L. Davidson, and J. Lankford: Exp. Mech., 1980, ser. 4, vol. 20, pp. 134–39

  14. E.A. Franke, D.J. Wenzel, and D.L. Davidson: Rev. Sci. Instrum., 1990, ser. 5, vol. 62, pp. 1270–79

  15. C. Laird: Fatigue Crack Propagation, ASTM STP 415, ASTM, Philadelphia, PA, 1967, pp. 131–68

  16. J.W. Hutchinson: J. Mech. Phys. Solids, 1968, 16:13–31

    Article  Google Scholar 

  17. J.R. Rice, G.F. Rosengren: J. Mech. Phys. Solids, 1968, 16:1–12

    Article  Google Scholar 

  18. R.A. Mirshams, C.H. Xiao, S.H. Whang, W.M. Yin: Mater. Sci. Eng., 2001, A315:21–27

    CAS  Google Scholar 

  19. F. Ericson: Mater. Sci. Eng., 1988, A105 and 106:131–41

    Google Scholar 

  20. H.D. Espinosa and B. Peng: J. Microelectromech. Sys., 2005, ser. 1, vol. 14, pp. 153–59

Download references

Acknowledgments

This research was supported by the Division of Materials Research, National Science Foundation (Grant No. DMR 0231418). The authors are grateful to the Program Manager, Dr. Carmen Huber, for her encouragement and support. The contribution of one of the authors (KSC) was supported by SwRI. The authors acknowledge the contributions by Messrs. John Campbell and James Spencer, both of SwRI, for performing the in-situ fracture tests and DISMAP strain measurements. One of the authors (BLB) thanks T.R. Christensen for the fabrication of the LIGA Ni test structures. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy’s National Nuclear Security Administration under Contract No. DE-AC04-94AL85000.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to W.O. Soboyejo.

Additional information

Manuscript submitted February 28, 2006.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Yang, Y., Allameh, S., Boyce, B. et al. An Experimental Study of Fracture of LIGA Ni Micro-Electro-Mechanical Systems Thin Films. Metall Mater Trans A 38, 1223–1230 (2007). https://doi.org/10.1007/s11661-007-9147-0

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11661-007-9147-0

Keywords

Navigation