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Thermal properties and kinetics of new-generation posterior bulk fill composite cured light-emitting diodes

TG, DSC, DMA

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Abstract

In this study, the thermal behavior in terms of glass transition (T g), degradation, and thermal stability of four commercial new-generation posterior bulk fill composites (Surefill SDR, Dentsply; Quixfill, Dentsply; Xtrabase, Voco; and Xtrafill, Voco) activated by light-emitting diodes (LEDs) was analyzed by thermogravimetric analysis (TG), differential scanning calorimetry (DSC), and dynamic mechanical analysis (DMA). The activation energies (E a) for the decomposition of the dental resins were calculated based on the Kissinger and Doyle kinetic models from the peaks of the endothermic curves obtained when the specimens were heated at four different temperatures (5, 10, 15, and 20 °C min−1) during DSC. The results show that the Xtrabase composite displayed the highest T g (120 °C at a 5 °C min−1 heating rate) and E a (157.64 kJ mol−1) values associated with thermal degradation from the main chain of the polymer.

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Acknowledgements

The authors would like to thank the Yildiz Technical University Research Foundation (Project No.: 2013-07-04-KAP04) for its financial support.

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Authors and Affiliations

  1. Chemical Engineering Department, Yıldız Technical University, Istanbul, Turkey

    Aysel Kantürk Figen

  2. Operative Dentisty Department, Marmara University, Istanbul, Turkey

    Pınar Yilmaz Atali

  3. Bioengineering Department, Yıldız Technical University, Istanbul, Turkey

    Mehmet Burçin Pişkin

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  1. Aysel Kantürk Figen
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  2. Pınar Yilmaz Atali
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  3. Mehmet Burçin Pişkin
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Correspondence to Aysel Kantürk Figen.

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Kantürk Figen, A., Yilmaz Atali, P. & Pişkin, M.B. Thermal properties and kinetics of new-generation posterior bulk fill composite cured light-emitting diodes. J Therm Anal Calorim 118, 31–42 (2014). https://doi.org/10.1007/s10973-014-3975-0

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  • DOI: https://doi.org/10.1007/s10973-014-3975-0

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