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Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders

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Abstract

The effects of TiO2 nanoparticles and cooling rate on the microstructure and mechanical properties of Sn1.5Sb0.7Cu alloy were investigated. A higher cooling rate and TiO2 nanoparticles refined the primary β-Sn dendrites, Cu6Sn5 and SbSn phase. Especially, the microstructure of the Sn1.5Sb0.7Cu composite solders under the rapid-cooled condition exhibited fine dot-like Cu6Sn5 in the eutectic regions. The improvement in strength was mostly attributed to (1) refinement of the β-Sn grain size; (2) the Orowan strengthening effect; (3) CTE mismatch between reinforcement second phase particles (Cu6Sn5 and TiO2) and the matrix; and (4) the load-bearing effect. However, the total elongation of the composite solders was observed to decrease because of micro-voids both at and along the Cu6Sn5 grain boundary regions. The fracture surfaces of all Sn1.5Sb0.7Cu composite solder were confirmed to exhibit the ductile fracture mode.

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Acknowledgments

The authors acknowledge the financial support of this work from the Ministry of Science and Technology, Taiwan, under Project No. MOST 103-2221-E-020-014. SEM was performed by the Precision Instrument Center of National Pingtung University of Science and Technology, Taiwan.

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Authors and Affiliations

  1. Department of Engineering Science, National Cheng Kung University, 1, University Road, 70101, Tainan City, Taiwan

    C. H. Huang & R. S. Chen

  2. Institute of Materials Engineering, National Pingtung University of Science and Technology, 1, Hseuhfu Road, 91201, Neipu, Pingtung, Taiwan

    Chin-Hsin Chen & L. C. Tsao

  3. Department of Mechanical Engineering, National Yunlin University of Science and Technology, 123, University Road Section 3, 64002, Touliu, Yunlin, Taiwan

    S. Y. Chang

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  1. C. H. Huang
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Correspondence to L. C. Tsao.

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Huang, C.H., Chen, CH., Chang, S.Y. et al. Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders. J Mater Sci: Mater Electron 26, 3493–3501 (2015). https://doi.org/10.1007/s10854-015-2860-3

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