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Modeling of effects of thermomechanical processing on elevated-temperature mechanical properties of in situ (TiB + TiC)/Ti-1100 composite

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Abstract

An in situ (TiB + TiC)/Ti-1100 composite was prepared by reacting B4C and Ti. The effect of the amount of deformation during thermomechanical processing (TMP) on the microstructure, orientation of TiB whiskers, and the mechanical properties of the composite were investigated. Improvements in the composite tensile strength from TMP are discussed in terms of grain refinement and TiB whisker rotation. A model is suggested to predict the TiB whisker orientation factor for the composite after TMP with various amounts of deformation. Based on the effect of grain refinement and rotation of the TiB whiskers, the yield strengths of the composite after TMP with various amounts of deformation were modeled. The modeled values agreed well with the test results.

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Acknowledgements

The authors would like to acknowledge the financial support provided by the National Research Fund of Science and Technology Commission of Shanghai Municipality under Grant Nos. 09ZR1422100 and 11441900501, the Innovation Research Fund of Shanghai Municipal Commission of Education under Grant No. 10YZ94, and the Key Laboratory of Advanced Metal-Based Electrical Power Materials.

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Authors and Affiliations

  1. School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai, 200093, China

    Fengcang Ma, Bo Zheng, Ping Liu, Wei Li, Xinkuan Liu, Xiaohong Chen, Ke Zhang & Deng Pan

  2. State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai, 200040, China

    Weijie Lu

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  1. Fengcang Ma
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  2. Bo Zheng
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  3. Ping Liu
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  4. Wei Li
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  6. Xiaohong Chen
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  7. Ke Zhang
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  8. Deng Pan
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  9. Weijie Lu
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Correspondence to Fengcang Ma or Ping Liu.

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Ma, F., Zheng, B., Liu, P. et al. Modeling of effects of thermomechanical processing on elevated-temperature mechanical properties of in situ (TiB + TiC)/Ti-1100 composite. J Mater Sci 51, 7502–7511 (2016). https://doi.org/10.1007/s10853-016-0029-y

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  • DOI: https://doi.org/10.1007/s10853-016-0029-y

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