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Co-W nanocrystalline electrodeposits as barrier for interconnects

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Abstract

This study was performed in order to investigate a possibility to obtain Co-W microbumps via electrochemical routes, because this alloy recently has gained attraction as a novel barrier against copper diffusion. In order to be applied in flip-chip technology, barrier layers should be void-free and uniformly deposited on the entire area of a die to ensure high reliability and high performance of wafer bump-solder interface. To meet these requirements, a set of potentiostatic and galvanostatic electrodeposition was carried out from a citrate electrolyte, at pH 5 and at room temperature. The tests done confirm that void-free Co-W bumps with a uniform tungsten content along the bump can be obtained by potentiostatic and galvanostatic electrodeposition. Successful electrodeposition of Cu/Co-W/Sn layers with good adhesion between them and uniformity on the entire array of bumps also was obtained. The XPS data confirm that electrodeposited Co-W layers can act as a good barrier between Sn and Cu.

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Acknowledgments

The authors acknowledge funding from the FP7 projects NANOALLOY (252407/909407) and the IRSES-project TEMADEP (247659). Also, partial funding was granted by the Lithuanian ESF agency (VP1-3.1-ŠMM-08-K-01-014), Lithuanian Research Council (MIP-031/2014) and MD project 72/ind. Authors are grateful to Dr. V. Kubilius (Vilnius University) for the resistance measurements done on the Co-W layers.

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Authors and Affiliations

  1. Institute of Applied Physics of ASM, 5 Academy str., Chisinau, 2028, Moldova

    N. Tsyntsaru

  2. Department of Physical Chemistry, Vilnius University, Naugarduko 24, Vilnius, 03225, Lithuania

    G. Kaziukaitis & H. Cesiulis

  3. Department of MTM, KU Leuven, Kasteelpark Arenberg 44, Leuven, 3001, Belgium

    C. Yang & J.-P. Celis

  4. IMEC, Kapeldreef 75, 3001, Heverlee, Belgium

    H. G. G. Philipsen

  5. Lithuanian Energy Institute, Breslaujos g. 3, Kaunas, 44403, Lithuania

    M. Lelis

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  1. N. Tsyntsaru
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  2. G. Kaziukaitis
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  3. C. Yang
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  4. H. Cesiulis
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  5. H. G. G. Philipsen
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  6. M. Lelis
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  7. J.-P. Celis
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Correspondence to N. Tsyntsaru.

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Tsyntsaru, N., Kaziukaitis, G., Yang, C. et al. Co-W nanocrystalline electrodeposits as barrier for interconnects. J Solid State Electrochem 18, 3057–3064 (2014). https://doi.org/10.1007/s10008-014-2488-x

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  • DOI: https://doi.org/10.1007/s10008-014-2488-x

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