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The electrodeposition of gold by pulse plating

Improvements in the properties of deposits

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Abstract

The replacement of a direct by a pulsed current in the electrodeposition of gold has a marked effect in improving the mechanical properties of the deposits and in reducing their internal stresses. For many applications in the electronics industry pulse plating therefore offers considerable advantages.

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Authors and Affiliations

  1. Forschungsinstitut für Edelmetalle und Mctallchemie, Schwäbisch Gmünd, West Germany

    Ch. J. Raub & A. Knödler

Authors
  1. Ch. J. Raub
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  2. A. Knödler
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Raub, C.J., Knödler, A. The electrodeposition of gold by pulse plating. Gold Bull 10, 38–44 (1977). https://doi.org/10.1007/BF03215426

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  • DOI: https://doi.org/10.1007/BF03215426

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