Abstract
Thermoelectric properties of the 0.05 wt.% SbI3-doped n-type Bi2(Teo.95Seo.o5)3 alloy, fabricated by hot pressing at temperatures ranging from 350°C to 550°C, were characterized. The electron concentration of the alloy decreased as the hot pressing temperature increased due to the annealing-out of the excess Te vacancies. When hot pressed at 350°C, a figure-of-merit of 0.75x10-3/K was obtained due to the low Seebeck coefficient of -145 µV/K and relatively high electrical resistivity of 2.05 mΩ-cm. Upon increasing the hot pressing temperature, however, the figure-of-merit was improved mainly due to the increase of the Seebeck coefficient. A maximum figure-of-merit of 2.1x10-3/K was obtained by hot pressing at 550°C.
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Lee, S.K., Oh, T.S., Hyun, D.B. et al. Thermoelectric properties of the 0.05 wt.% SbI3-Doped n-Type Bi2(Te0. 95Se0. 05)3 alloy fabricated by the hot pressing method. Metals and Materials 6, 67–71 (2000). https://doi.org/10.1007/BF03026347
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DOI: https://doi.org/10.1007/BF03026347