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Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

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Abstract

The interaction between isothermal aging and the long-term reliability of fine-pitch ball grid array (BGA) packages with Sn-3.0Ag-0.5Cu (wt.%) solder ball interconnects was investigated. In this study, 0.4-mm fine-pitch packages with 300-μm-diameter Sn-Ag-Cu solder balls were used. Two different package substrate surface finishes were selected to compare their effects on the final solder composition, especially the effect of Ni, during thermal cycling. To study the impact on thermal performance and long-term reliability, samples were isothermally aged and thermally cycled from 0°C to 100°C with 10 min dwell time. Based on Weibull plots for each aging condition, package lifetime was reduced by approximately 44% by aging at 150°C. Aging at 100°C showed a smaller impact but similar trend. The microstructure evolution was observed during thermal aging and thermal cycling with different phase microstructure transformations between electrolytic Ni/Au and organic solderability preservative (OSP) surface finishes, focusing on the microstructure evolution near the package-side interface. Different mechanisms after aging at various conditions were observed, and their impacts on the fatigue lifetime of solder joints are discussed.

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References

  1. J. Glazer, Int. Mater. Rev. 40, 65 (1995).

    CAS  Google Scholar 

  2. H.K. Kim and K.N. Tu, Phys. Rev. B 53, 16027 (1996).

    Article  CAS  ADS  Google Scholar 

  3. J. Glazer, J. Electron. Mater. 23, 8 (1994).

    Article  Google Scholar 

  4. W. Xie, T.-K. Lee, K.-C. Liu, and J. Xue, IEEE 60th Electronic Components and Technology Conference (ECTC) (Las Vegas, NV, June 2010).

  5. H.G. Song, J.W. Morris Jr., and F. Hua, JOM 56, 30 (2002).

    Article  Google Scholar 

  6. K.W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker, J. Electron. Mater. 29, 1122 (2000).

    Article  CAS  ADS  Google Scholar 

  7. D.R. Frear and P.T. Vianco, Metall. Trans. A 25A, 1509 (1994).

    Article  CAS  Google Scholar 

  8. W.K. Choi and H.M. Lee, J. Electron. Mater. 29, 10 (2000).

    Article  Google Scholar 

  9. A.J. Sunwoo, J.W. Morris Jr., and G.K. Lucey Jr., Metall. Trans. A 23A, 1323 (1992).

    CAS  ADS  Google Scholar 

  10. Z. Mei and J.W. Morris, J. Electron. Mater. 21, 599 (1992).

    Article  CAS  ADS  Google Scholar 

  11. F. Bartels, J.W. Morris Jr., G. Dalke, and W. Gust, J. Electron. Mater. 23, 787 (1994).

    Article  CAS  ADS  Google Scholar 

  12. H. Ma, T.-K. Lee, D.H. Kim, S.H. Kim, H.G. Park, and K.-C. Liu, IEEE 59th Electronic Components and Technology Conference (ECTC) (San Diego, May 2009).

  13. H. Ma, J.C. Suhling, P. Lall, and M.J. Bozack, Proceeding of the 56th Electronic Components and Technology Conference (San Diego, California, May 2006).

  14. C.-Y. Yu, T.-K. Lee, M. Tsai, K.-C. Liu, and J.-G. Duh, J. Electron. Mater., this volume (2010).

  15. T.-K. Lee, K.-C. Liu, and T.R. Bieler, J. Electron. Mater. 38, 2685 (2009).

    Article  CAS  ADS  Google Scholar 

  16. T.R. Bieler, T.-K. Lee, and K.-C. Liu, J. Electron. Mater. 38, 2712 (2009).

    Article  CAS  ADS  Google Scholar 

  17. B. Zhou, T.R. Bieler, T.-K. Lee, and K.-C. Liu, J. Electron. Mater. 38, 2702 (2009).

    Article  CAS  ADS  Google Scholar 

  18. T. Laurila, V. Vuorinen, and J.K. Kivilahti, Mater. Sci. Eng. R 49, 1 (2005).

    Article  Google Scholar 

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Authors and Affiliations

  1. Component Quality and Technology Group, Cisco Systems, Inc., San Jose, CA, 95134, USA

    Tae-Kyu Lee, Hongtao Ma, Kuo-Chuan Liu & Jie Xue

Authors
  1. Tae-Kyu Lee
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  2. Hongtao Ma
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  3. Kuo-Chuan Liu
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  4. Jie Xue
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Correspondence to Tae-Kyu Lee.

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Lee, TK., Ma, H., Liu, KC. et al. Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects. J. Electron. Mater. 39, 2564–2573 (2010). https://doi.org/10.1007/s11664-010-1352-8

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  • DOI: https://doi.org/10.1007/s11664-010-1352-8

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