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Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy

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Abstract

Electron backscatter diffraction and polarized light microscopy have been used to quantify the number of crystallographically independent β-Sn dendrites present in near-eutectic, ball grid array Sn-Ag-Cu (SAC) solder balls as a function of cooling rate (0.35–3.0°C/s). Based on these data, it is estimated that a single 900-µm-diameter solder ball contains on average eight individual β-Sn dendrites, independent of cooling rate. Specific orientation relationships were also found to be prevalent between neighboring β-Sn dendrites. These results confirm and expand upon recent research, and further emphasize the probable anisotropic nature of SAC solder joints.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Michigan Technological University, 49931, Houghton, MI

    A. LaLonde, D. Emelander, J. Jeannette, C. Larson, W. Rietz & D. Swenson

  2. IBM Microelectronics, 12533, East Fishkill, NY

    D. W. Henderson

Authors
  1. A. LaLonde
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  2. D. Emelander
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  3. J. Jeannette
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  4. C. Larson
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  5. W. Rietz
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  6. D. Swenson
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  7. D. W. Henderson
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LaLonde, A., Emelander, D., Jeannette, J. et al. Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy. J. Electron. Mater. 33, 1545–1549 (2004). https://doi.org/10.1007/s11664-004-0096-8

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  • DOI: https://doi.org/10.1007/s11664-004-0096-8

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