Abstract
Recent developments on decreasing the operating temperature for solid oxide fuel cells (SOFCs) have enabled the use of high-temperature ferritic alloys as interconnect materials. Oxide scale will inevitably grow on the ferritic interconnects in a high-temperature oxidation environment of SOFCs. The growth of the oxide scale induces growth stresses in the scale layer and on the scale/substrate interface. These growth stresses combined with the thermal stresses induced after stacking cooling by the thermal expansion coefficient mismatch between the oxide scale and the substrate may lead to scale delamination/buckling and eventual spallation, which may lead to serious cell performance degradation. Hence, the interfacial adhesion strength between the oxide scale and the substrate is crucial to the reliability and durability of the metallic interconnect in SOFC operating environments. In this article, we applied an integrated experimental/modeling methodology to quantify the interfacial adhesion strength between the oxide scale and the SS 441 metallic interconnect. The predicted interfacial strength is discussed in detail.
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Acknowledgments
The Pacific Northwest National Laboratory is operated by Battelle Memorial Institute for the U.S. Department of Energy under Contract DE-AC06-76RL01830. This work was funded as part of the Solid-State Energy Conversion Alliance (SECA) Core Technology Program by the U.S. Department of Energy’s National Energy Technology Laboratory (NETL).
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Manuscript submitted July 20, 2010.
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Liu, W., Sun, X., Stephens, E. et al. Interfacial Shear Strength of Oxide Scale and SS 441 Substrate. Metall Mater Trans A 42, 1222–1228 (2011). https://doi.org/10.1007/s11661-010-0537-3
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DOI: https://doi.org/10.1007/s11661-010-0537-3