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Curing behavior of epoxy resins with a series of novel curing agents containing 4,4′-biphenyl and varying methylene units

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Abstract

A new homologous series of curing agents (LCECAn) containing 4,4′-biphenyl and n-methylene units (n = 2, 4, 6) were successfully synthesized. The curing behaviors of a commercial diglycidyl ether of bisphenol-A epoxy (E-51) and 4,4′-bis(2,3-epoxypropoxy)biphenyl (LCE) by using LCECAn as the curing agent have been investigated by differential scanning calorimetry (DSC), respectively. The Ozawa equation was applied to the curing kinetics based upon the dynamic DSC data, and the isothermal DSC data were fitted using an autocatalytic curing model. The glass transition temperatures (T g) of the cured epoxy systems were determined by DSC upon the second heating, and the thermal decomposition temperatures (T d) were obtained by thermogravimetric (TG) analyses. The results show that the number of methylene units in LCECAn has little influence on the curing temperatures of E-51/LCECAn and LCE/LCECAn systems. In addition, the activation energies obtained by the dynamic method proved to be larger than those by the isothermal method. Furthermore, both the T g and T d of the cured E-51/LCECAn systems and LCE/LCECAn systems decreased with the increase in the number of methylene units in LCECAn.

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Acknowledgements

Financial support provided by the National Natural Science Foundation of China (No. 50673042), and the Doctoral Discipline Foundation of Ministry of Education of China (No. 20070055015) is gratefully acknowledged.

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Authors and Affiliations

  1. Department of Chemistry, Nankai University, Tianjin, 300071, China

    Qing Guo, Yan Huang, Yu-Ying Zhang, Li-Rong Zhu & Bao-Long Zhang

Authors
  1. Qing Guo
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  2. Yan Huang
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  3. Yu-Ying Zhang
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  4. Li-Rong Zhu
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Correspondence to Yu-Ying Zhang.

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Guo, Q., Huang, Y., Zhang, YY. et al. Curing behavior of epoxy resins with a series of novel curing agents containing 4,4′-biphenyl and varying methylene units. J Therm Anal Calorim 102, 915–922 (2010). https://doi.org/10.1007/s10973-010-0764-2

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  • DOI: https://doi.org/10.1007/s10973-010-0764-2

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