Abstract
Porosified silicon wafers or powders from electrochemical etching of bulk silicon, or from silica reduction, often require a series of additional processing steps, prior to use. In this expanded review a compendium of over 70 processing techniques is provided, linking all of them to either dedicated process reviews or related chapters in the handbook. The processing techniques are grouped into 8 processing functions: patterning, size reduction, size classification, drying, passivation, coating, pore impregnation and skeleton doping. Typical process flows are illustrated for wafer substrates, membranes, particles and composites, giving examples of where the choice and order of processing steps can be important. Examples are also given of processing topics yet to be widely explored with porous silicon, but which could become important for some of the emerging applications.
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Canham, L. (2018). Processing Techniques and Process Flows with Porous Silicon. In: Canham, L. (eds) Handbook of Porous Silicon. Springer, Cham. https://doi.org/10.1007/978-3-319-04508-5_53-3
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DOI: https://doi.org/10.1007/978-3-319-04508-5_53-3
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Processing Techniques and Process Flows with Porous Silicon- Published:
- 07 December 2017
DOI: https://doi.org/10.1007/978-3-319-04508-5_53-3
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Typical Processing Steps with Porous Silicon
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- 11 July 2017
DOI: https://doi.org/10.1007/978-3-319-04508-5_53-2
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Typical Processing Steps with Porous Silicon- Published:
- 08 September 2014
DOI: https://doi.org/10.1007/978-3-319-04508-5_53-1