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NDE for Electronic Packaging

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Handbook of Nondestructive Evaluation 4.0

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Abstract

Electronics and microsystem technology products have become an indispensable part of our lives and largely have enabled technical progress and the development of industrial and media society. The advancing miniaturization and thus the development towards the nano-packaging has posed a particular challenge in recent years. It needs corresponding non-destructive evaluation methods with high resolution like X-ray Computed Tomography to evaluate these technologies and to bring them to production lines.

This chapter is intended to present the status of non-destructive testing methods for electronics packaging to users in research and production. The latest developments are also taken into account and the specifics of the electronics industry are discussed.

The most parts of this publication base on the authors chapters in [3].

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Abbreviations

AFM:

atomic force microscope

AI:

artificial intelligence

AOI:

automated optical inspection

AXI:

automated X-ray inspection

BGA:

package type “ball grid array”

CCD:

charge-coupled device

CMOS:

complementary metal oxide semiconductor

CT:

computed tomography

DCB:

direct copper bonded

FET:

field-effect transistor

GPS:

global positioning system

GV:

grey value

IC:

integrated circuit

IGBT:

insulated-gate bipolar transistor

LGA:

package type “land grid array”

MELF:

package type for resistors “metal electrode leadless faces”

nc:

not connected

NDE:

non-destructive evaluation

NDT:

non-destructive testing

OVHM:

oblique views at highest magnification

PCB:

printed circuit board

Pixel:

picture element

QFN:

package type “quad flat no leads”

ROI:

region of interest

SAM:

scanning acoustic microscope

SEM:

scanning electron microscope

SiP:

package type “system-in-package”

SMD:

surface mounted device

SMT:

surface mounted technology

SO:

package type “small outline”

SPI:

solder paste inspection

THT:

through hole technology

TSV:

through silicon via

USB:

universal serial bus

Voxel:

volumetric picture element

WLAN:

wireless local area network

References

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Author information

Authors and Affiliations

  1. Centre for Microtechnical Manufacturing, Technische Universität Dresden, Dresden, Germany

    Martin Oppermann

  2. GÖPEL electronic GmbH, Jena, Germany

    Johannes Richter & Jörg Schambach

  3. University of Dayton, Dayton, OH, USA

    Norbert Meyendorf

  4. Institute of Electronic Packaging Technology, Technische Universität Dresden, Dresden, Germany

    Norbert Meyendorf

Authors
  1. Martin Oppermann
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  2. Johannes Richter
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  3. Jörg Schambach
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  4. Norbert Meyendorf
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Corresponding author

Correspondence to Martin Oppermann .

Editor information

Editors and Affiliations

  1. University of Dayton, Dayton, OH, USA

    Norbert Meyendorf

  2. The University of Akron, Akron, OH, USA

    Nathan Ida

  3. Inspiring Next, Cromwell, CT, USA

    Ripi Singh

  4. Vrana GmbH, München, Germany

    Johannes Vrana

Section Editor information

  1. Chemical Materials and Bio Engineering, University of Dayton, Dayton, OH, USA

    Norbert Meyendorf

  2. Department of Electrical and Computer Engineering, The University of Akron, Akron, OH, USA

    Nathan Ida

  3. Inspiring Next, Plus4Pi LLC, Cromwell, CT, USA

    Ripi Singh

  4. Vrana GmbH, Rimsting, Deutschland, Deutschland

    Johannes Vrana

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Oppermann, M., Richter, J., Schambach, J., Meyendorf, N. (2022). NDE for Electronic Packaging. In: Meyendorf, N., Ida, N., Singh, R., Vrana, J. (eds) Handbook of Nondestructive Evaluation 4.0. Springer, Cham. https://doi.org/10.1007/978-3-030-48200-8_46-2

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  • DOI: https://doi.org/10.1007/978-3-030-48200-8_46-2

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-48200-8

  • Online ISBN: 978-3-030-48200-8

  • eBook Packages: Springer Reference Chemistry and Mat. ScienceReference Module Physical and Materials ScienceReference Module Chemistry, Materials and Physics

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Chapter history

  1. Latest

    NDE for Electronic Packaging
    Published:
    13 November 2021

    DOI: https://doi.org/10.1007/978-3-030-48200-8_46-2

  2. Original

    NDE for Electronics Packaging
    Published:
    31 August 2021

    DOI: https://doi.org/10.1007/978-3-030-48200-8_46-1

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