Sensors and smart electronics in harsh environment applications W. R. FahrnerR. JobM. Werner Pages: 138 - 144
Highly parallel mass fabrication and assembly of microdevices W. EhrfeldM. BegemannM. Nienhaus Pages: 145 - 150
Dicing challenges in microelectronics and micro electro-mechanical systems (MEMS) H. H. Gatzen Pages: 151 - 154
Plastic reshaping of silicon microstructures: process, characterization and application E. GärtnerJ. FrühaufE. Jänsch Pages: 155 - 160
Internal stresses and lifetime evaluation of PECVD isolating layers A. DommannN. HerresB. Stämpfli Pages: 161 - 164
Micromechanical three-axial tactile force sensor for micromaterial characterisation S. BütefischS. BüttgenbachU. Brand Pages: 171 - 174
Fatigue of directly wafer-bonded silicon under static and cyclic loading J. BagdahnM. Petzold Pages: 175 - 182
Integration of micro-mechatronics in automotive applications F. AnsorgeK.-F. BeckerH. Reichl Pages: 188 - 190
Application of electroplating in MEMS-micromachining exemplified by a microrelay M. BeckerD. Lütke NotarpB. Michel Pages: 196 - 202