Three-dimensional micro-structures consisting of high aspect ratio inclined micro-pillars fabricated by simple photolithography H. SatoY. HoushiS. Shoji OriginalPaper Pages: 440 - 443
Two-dimensional modeling of nickel electrodeposition in LIGA microfabrication K. S. ChenG. H. Evans OriginalPaper Pages: 444 - 450
Effects of microstructure on the mechanical properties of copper films for high aspect ratio structures M. J. CordillT. MuppidiD. F. Bahr OriginalPaper Pages: 451 - 455
Micro gas bearings fabricated by deep X-ray lithography D. KimS. LeeJ. Goettert OriginalPaper Pages: 456 - 461
Combination of thick resist and electroforming technologies for monolithic inkjet application C. K. ChungC. J. LinM. Q. Tsai OriginalPaper Pages: 462 - 466
Selection of mold materials for electroforming of monolithic two-layer microstructure C. K. ChungC. J. LinY. Z. Hong OriginalPaper Pages: 467 - 471
Effect of workpiece springback on micromilling forces C. R. FriedrichV. P. Kulkarni OriginalPaper Pages: 472 - 477
Active positioning device for a perimodiolar cochlear electrode array B. Y. ArcandP. T. BhattiK. D. Wise OriginalPaper Pages: 478 - 483
Replication of LIGA structures using microcasting G. BaumeisterR. RuprechtJ. Hausselt OriginalPaper Pages: 484 - 488
Determination of mechanical properties of slip cast, micro powder injection moulded and microcast high aspect ratio microspecimens M. AuhornT. BeckD. Löhe OriginalPaper Pages: 489 - 492
Deep sub micron high aspect ratio polymer structures produced by hard X-ray lithography S. Achenbach OriginalPaper Pages: 493 - 497
Electrodeposited nickel–manganese: an alloy for microsystem applications S. H. GoodsJ. J. KellyN. Y. C. Yang OriginalPaper Pages: 498 - 505
The mechanical properties, dimensional tolerance and microstructural characterization of micro-molded ceramic and metal components T. J. GarinoA. M. MoralesB. L. Boyce OriginalPaper Pages: 506 - 509
The role of microstructure in the electrical and thermal conductivity of Ni-alloys for LIGA microsystems S. GrahamJ. KelleyT. Borca-Tasciuc OriginalPaper Pages: 510 - 516
High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging C.-J. LinM.-T. LinF.-G. Tseng OriginalPaper Pages: 517 - 521
A Micro corona motor fabricated by a SU-8 built-on X-ray mask S. LeeD. KimJ. Goettert OriginalPaper Pages: 522 - 526
Shape deviations in masks for optical structures produced by electron beam lithography A. LastH. HeinJ. Mohr OriginalPaper Pages: 527 - 530
Replication of microlens arrays by injection molding B.-K. LeeD. S. KimT. H. Kwon OriginalPaper Pages: 531 - 535
Fabrication of grids and collimators using SU-8 as a mold O. V. MakarovaV. N. ZyryanovC.-M. Tang OriginalPaper Pages: 536 - 539
Fabrication of focused two-dimensional grids O. V. MakarovaD. C. ManciniC.-M. Tang OriginalPaper Pages: 540 - 543
SOI wafer mold with high-aspect-ratio microstructures for hot embossing process Y. ZhaoT. Cui OriginalPaper Pages: 544 - 546
Replication of micro components by different variants of injection molding V. PiotterN. HolsteinJ. Hausselt OriginalPaper Pages: 547 - 551
Production of identical pyramid wavefront sensors for multi-conjugate adaptive optic systems using the LIGA process F. PérennèsM. GhigoS. Cabrini OriginalPaper Pages: 552 - 555
Evaluation of optical qualities of a LIGA-spectrometer in SU-8 T. MappesS. AchenbachR. Truckenmüller OriginalPaper Pages: 560 - 563
High aspect ratio spiral and vertical meander micro coils for actuator applications V. SeidemannT. KohlmeierS. Büttgenbach OriginalPaper Pages: 564 - 570
High-aspect-ratio microstructure filling by centrifugal force field modeling T.-H. TsaiH. YangR. Chein OriginalPaper Pages: 571 - 577