1. Making Like Dolphins

   • John L. Simonds

   Material Matters 26 September 2020 Pages: 5 - 6

2. Letters to the Editor

   • Gregory R. Moore

   Departments 26 September 2020 Pages: 8 - 8

3. Research/Researchers

   dh]Departments 26 September 2020 Pages: 11 - 20

4. Washington News

   Departments 26 September 2020 Pages: 21 - 21

5. Public Affairs Forum

   • Bill Appleton

   Departments 26 September 2020 Pages: 22 - 22

6. Resources

   Departments 26 September 2020 Pages: 29 - 29

7. Metallization for Integrated Circuit Manufacturing

   • R. V. Joshi
   • R. S. Blewer
   • S. Murarka

   Metallization for Integrated Circuit Manufacturing 26 September 2020 Pages: 33 - 37

8. Chemical Vapor Deposition of TIN for Sub-0.5 jum ULSI Circuits

   • M. Eizenberg

   Metallization for Integrated Circuit Manufacturing 26 September 2020 Pages: 38 - 41

9. Collimated Sputtering of Titanium and Titanium Nitride Films

   • James G. Ryan
   • Stephen B. Brodsky
   • Hideaki Aochi

   Metallization for Integrated Circuit Manufacturing 26 September 2020 Pages: 42 - 45

10. Chemical-Vapor-Deposited Tungsten for Vertical Wiring

    • Takayuki Ohba

    Metallization for Integrated Circuit Manufacturing 26 September 2020 Pages: 46 - 52

11. Aluminum Reflow Sputtering

    • Kuniko Kikuta

    Metallization for Integrated Circuit Manufacturing 26 September 2020 Pages: 53 - 56

12. Advertisers in This Issue

    Departments 26 September 2020 Pages: 56 - 56

13. Aluminum-Based Metallurgy for Global Interconnects

    • Dipankar Pramanik

    Metallization for Integrated Circuit Manufacturing 26 September 2020 Pages: 57 - 60

14. Chemical-Mechanical Planarization of Aluminum-Based Alloys for Multilevel Metallization

    • M. A. Fury
    • D. L. Scherber
    • M. A. Stell

    Metallization for Integrated Circuit Manufacturing 26 September 2020 Pages: 61 - 64

15. Simulation of Microstructure and Surface Profiles of Thin Films for VLSI Metallization

    • T. Smy
    • S. K. Dew
    • M. J. Brett

    Metallization for Integrated Circuit Manufacturing 26 September 2020 Pages: 65 - 69

16. Mechanical Stress in VLSI Interconnections: Origins, Effects, Measurement, and Modeling

    • Paul A. Flinn

    Metallization for Integrated Circuit Manufacturing 26 September 2020 Pages: 70 - 73

17. New Rapid Failure Analysis Techniques for Multilevel Metallization

    • Edward I. Cole Jr.
    • Richard E. Anderson

    Metallization for Integrated Circuit Manufacturing 26 September 2020 Pages: 74 - 77

18. The Reliability of Aluminum/Tungsten Technology for VLSI Applications

    • Yosi Shacham-Diamand

    Metallization for Integrated Circuit Manufacturing 26 September 2020 Pages: 78 - 82

19. Walker, Chair of the House Committee on Science, to Give Plenary Talk

    MRS News 26 September 2020 Pages: 89 - 89

20. Mullins Receives Von Hippel Award

    MRS News 26 September 2020 Pages: 90 - 90

21. De Fontaine Selected for Turnbull Lectureship

    MRS News 26 September 2020 Pages: 91 - 91

22. Materials Research Society Election Results for 1996

    MRS News 26 September 2020 Pages: 91 - 91

23. Capasso, Tromp Receive 1995 MRS Medals

    MRS News 26 September 2020 Pages: 92 - 92

24. Graduate Student Award Finalists–1995 MRS Fall Meeting

    MRS News 29 November 2013 Pages: 94 - 94

25. New Symposium Tutorial Program Debuts at the 1995 MRS Fall Meeting

    • Nemanich J. Robert

    MRS News 29 November 2013 Pages: 98 - 99

26. Subcommittee Reports on Special Projects

    MRS News 29 November 2013 Pages: 100 - 100

27. Historical Note

    Departments 29 November 2013 Pages: 101 - 103

28. Abstracts for January 1996 Journal of Materials Research

    JMR ABSTRACTS 26 September 2020 Pages: 106 - 111

29. Calendar

    Departments 26 September 2020 Pages: 113 - 115

30. Classified

    Departments 29 November 2013 Pages: 116 - 119

31. Posterminaries

    Departments 29 November 2013 Pages: 120 - 120