Copper Wire Bonding Concerns and Best Practices Preeti ChauhanZ. W. ZhongMichael Pecht ReviewPaper 08 May 2013 Pages: 2415 - 2434
Influence of Interference on Extraction Efficiency of Ultraviolet Vertical Light-Emitting Diodes Seung Hwan KimYoung Ho SongHyung Jo Park BriefCommunication 25 May 2013 Pages: 2435 - 2438
Investigation of Characteristics of Al2O3/n-In x Ga1−x As (x = 0.53, 0.7, and 1) Metal–Oxide–Semiconductor Structures Hai-Dang TrinhYueh-Chin LinDavid Hwang BriefCommunication 29 May 2013 Pages: 2439 - 2444
Thick In x Ga1−x N Films Prepared by Reactive Sputtering with Single Cermet Targets Cheng-Che LiDong-Hau KuoYing-Sheng Huang BriefCommunication 11 June 2013 Pages: 2445 - 2449
Dynamical X-ray Diffraction from In x Ga1−x As Heterostructures with Dislocations P. B. RagoJ. E. Ayers OriginalPaper 09 May 2013 Pages: 2450 - 2458
Effects of Growth Temperature and Annealing on Properties of Zn3Sn2O7 Thin Films and Application in TFTs Yong-Yue ChenXi-Kun CaiHui-Zhen Wu OriginalPaper 30 April 2013 Pages: 2459 - 2463
Improvement of the Crystallinity of Silicon Films Deposited by Hot-Wire Chemical Vapor Deposition with Negative Substrate Bias Lei ZhangHonglie ShenJiayi You OriginalPaper 25 May 2013 Pages: 2464 - 2469
Improvement in the Bias Stability of Zinc-Tin Oxide Thin-Film Transistors by Hafnium Doping Dong-Suk HanJae-Hyung ParkJong-Wan Park OriginalPaper 25 May 2013 Pages: 2470 - 2477
Comparison of Phase Shifting Techniques for Measuring In-Plane Residual Stress in Thin, Flat Silicon Wafers R. G. R. PrasathK. SkenesS. Danyluk OriginalPaper 07 June 2013 Pages: 2478 - 2485
Structural and Carrier Dynamics of GaN and AlGaN-Based Double Heterostructures in the UV Region Ponnusamy ArivazhaganRaju RameshKrishnan Baskar OriginalPaper 11 June 2013 Pages: 2486 - 2491
Theoretical Study on Structural Stability of Fully Filled p-Type Skutterudites RETM4Sb12 (RE = Rare Earth; TM = Fe, Ru) Zhuo ChenJiong YangJihui Yang OriginalPaper 30 April 2013 Pages: 2492 - 2497
Heraclenin: A Potential Optoelectronic Device Material from Prangos pabularia Javid A. BandayGhulam M. BhatTej K. Razdan OriginalPaper 04 May 2013 Pages: 2498 - 2503
Atomistic Simulation of Strain-Induced Domain Evolution in a Uniaxially Compressed BaTiO3 Single-Crystal Nanofilm Xiao Bao TianXin Hua YangWei Zhong Cao OriginalPaper 30 April 2013 Pages: 2504 - 2509
Resistive Switching Properties of Sol–Gel-Derived V-Doped SrTiO3 Thin Films Zhen Hua TangYing XiongLong Hai Wang OriginalPaper 30 April 2013 Pages: 2510 - 2515
Mixed-Alkali Effect in Li2O–Na2O–K2O–B2O3 Glasses: Infrared and Optical Absorption Studies M.A. SameeA. EdukondaluSyed Rahman OriginalPaper 07 May 2013 Pages: 2516 - 2524
Ultrafast UV-Curable Adhesives for Optical Pick-Ups Chang-Kyu ChungKyung-Woon JangChulho Jeon OriginalPaper 24 May 2013 Pages: 2525 - 2535
Structure and Optical Properties of CeO2 Nanoparticles Synthesized by Precipitation I-Tsan LiuMin-Hsiung HonLay Gaik Teoh OriginalPaper 25 May 2013 Pages: 2536 - 2541
Low-Temperature Sintering of Ba0.5Sr0.5TiO3-SrMoO4 Dielectric Tunable Composite Ceramics for LTCC Applications Linjiang TangJinwen WangJiwei Zhai OriginalPaper 25 May 2013 Pages: 2542 - 2548
Synthesis, Structural and Optical Characterization of Sol–Gel-Derived Y-Doped Mesoporous CeO2 Ying Chieh LeeKun-Dar LiGhi Wei Chiang OriginalPaper 06 June 2013 Pages: 2549 - 2555
Temperature Stability of V2O5-Doped KNN-LS-BF Lead-Free Piezoelectric Ceramics Hua WangXia ZhaiLing Yang OriginalPaper 29 May 2013 Pages: 2556 - 2559
Quantum Theory of the Burns Temperature in Barium Titanate G.D. Mahan OriginalPaper 11 June 2013 Pages: 2560 - 2563
PIN-PMN-PT Single-Crystal-Based 1–3 Piezoelectric Composites for Ultrasonic Transducer Applications Lili LiZhuo XuShaojun Long OriginalPaper 11 June 2013 Pages: 2564 - 2569
Thermoelectric Properties of Y1−x Ag x BaCo4O7+δ Ceramics Q. L. HeJ. ZhangH. Z. Song OriginalPaper 07 June 2013 Pages: 2570 - 2573
Thermal Decomposition of Thermoelectric Material CoSb3: A Thermogravimetry Kinetic Analysis Fang WuQingli HeXing Hu OriginalPaper 08 June 2013 Pages: 2574 - 2581
Thermoelectric Properties of Ca3−x Dy x Co4O9+δ with x = 0.00, 0.02, 0.05, and 0.10 Ankam BhaskarC.-S. JhangChia-Jyi Liu OriginalPaper 11 June 2013 Pages: 2582 - 2586
Dielectric and Pyroelectric Properties of La- and Pr-Modified Tungsten-Bronze Ferroelectrics B. N. ParidaPiyush R. DasR. N. P. Choudhary OriginalPaper 11 June 2013 Pages: 2587 - 2594
A Facile Synthesis of a Palladium-Doped Polyaniline-Modified Carbon Nanotube Composites for Supercapacitors Soumen GiriDebasis GhoshChapal Kumar Das OriginalPaper 27 April 2013 Pages: 2595 - 2605
Modeling the Rate-Dependent Durability of Reduced-Ag SAC Interconnects for Area Array Packages Under Torsion Loads Vikram SrinivasSandeep MenonMichael G. Pecht OriginalPaper 26 April 2013 Pages: 2606 - 2614
Thermodynamic Assessment of the In-Ni-Sb System and Predictions for Thermally Stable Contacts to InSb Zhanmin CaoWei XieZhiyu Qiao OriginalPaper 07 May 2013 Pages: 2615 - 2629
A Feature-Scale Greenwood–Williamson Model for Metal Chemical Mechanical Planarization Qinzhi XuLan Chen OriginalPaper 01 May 2013 Pages: 2630 - 2640
Microstructure Evolution of Cu-Cored Sn Solder Joints Under High Temperature and High Current Density Xianzhang SaPing Wu OriginalPaper 04 May 2013 Pages: 2641 - 2647
Effect of Thickness and Phosphorus Content on Au/Pd/Ni(P) Metal Finish of Printed Circuit Board Chih-Kai HuangKeh-Wen LinMeng-Hui Li OriginalPaper 25 May 2013 Pages: 2648 - 2657
Phase-Field Modeling and Experimental Observation of Microstructures in Solidifying Sn-Ag-Cu Solders G.J. SchmitzB. ZhouJ. Villain OriginalPaper 25 May 2013 Pages: 2658 - 2666
Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates Ahmed SharifJun zhang LimZhong Chen OriginalPaper 25 May 2013 Pages: 2667 - 2676
Kinetics of Dissolution and Isothermal Solidification for Gold-Enriched Solid–Liquid Interdiffusion (SLID) Bonding Rogie I. RodriguezDimeji IbitayoPedro O. Quintero OriginalPaper 11 June 2013 Pages: 2677 - 2685
A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified Sn-3.5Ag Lead-Free Solder Hai-Tao MaJie WangA. Kunwar OriginalPaper 01 June 2013 Pages: 2686 - 2695
Spreading Behavior and Evolution of IMCs During Reactive Wetting of SAC Solders on Smooth and Rough Copper Substrates SatyanarayanK. N. Prabhu OriginalPaper 11 June 2013 Pages: 2696 - 2707
Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free Solder Xu ChenFeng XueGuotong Qian OriginalPaper 25 May 2013 Pages: 2708 - 2715
Effect of Ti Concentration on the Growth of Nb3Sn Between Solid Nb(Ti) and Liquid Sn Sangeeta SantraAloke Paul OriginalPaper 11 June 2013 Pages: 2716 - 2723
Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies Ye TianXi LiuSuresh K. Sitaraman OriginalPaper 11 June 2013 Pages: 2724 - 2731