Internal Microstructure Investigation of Tin Whisker Growth Using FIB Technology Aleksandra FortierRadovan Kovacevic OriginalPaper 13 April 2012 Pages: 2029 - 2034
Liquid-Phase Separation in the Interdendritic Region After Growth of Primary β-Sn in Undercooled Sn-2.8Ag-0.3Cu Melt Yoshiko TakamatsuHisao EsakaKei Shinozuka OriginalPaper 07 April 2012 Pages: 2035 - 2044
Cu5Zn8 Growth Reversion in Cu/Sn-8Zn-3Bi/Cu During Discontinuous Electromigration Jibin LiuWei ZhouPing Wu OriginalPaper 31 May 2012 Pages: 2045 - 2050
Reactive Wetting Processes and Triple-Line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures Likun ZangZhangfu YuanFumitaka Tsukihashi OriginalPaper 10 April 2012 Pages: 2051 - 2056
Nanoindentation Creep Behavior of Nanocomposite Sn-Ag-Cu Solders A. RoshanghiasA. H. KokabiH. R. Madaah-Hosseini OriginalPaper 13 April 2012 Pages: 2057 - 2064
Electronic Properties as a Function of Ag/Sb Ratio in Ag1−y Pb18Sb1+z Te20 Compounds Jayaram DaddaEckhard MüllerRaphael Hermann OriginalPaper 10 May 2012 Pages: 2065 - 2072
Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications Dhafer Abdul-Ameer ShnawahSuhana Binti Mohd SaidAdnan Naama Abood OriginalPaper 26 May 2012 Pages: 2073 - 2082
The Effect of Crystallographic Orientation on the Mechanical Behavior of Cu6Sn5 by Micropillar Compression Testing Ling JiangHanqing JiangNikhilesh Chawla OriginalPaper 31 May 2012 Pages: 2083 - 2088
Modeling Fracture of Sn-Rich (Pb-Free) Solder Joints Under Mechanical Shock Conditions Huiyang FeiKyle YazzieHanqing Jiang OriginalPaper 10 April 2012 Pages: 2089 - 2099
Solder Characteristics of a Rapidly Solidified Sn-9Zn-0.1Cr Alloy and Mechanical Properties of Cu/Solder/Cu Joints Guoji ZhaoGuangmin ShengXinjian Yuan OriginalPaper 04 April 2012 Pages: 2100 - 2106
Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics Vivek ChidambaramHo Beng YeungGao Shan OriginalPaper 10 May 2012 Pages: 2107 - 2117
Effect of Addition of Ag, In or Pb on the Structure and Thermoelectric Performance of β-Zn4Sb3 F.S. LiuL.C. PanJ. Q. Li OriginalPaper 31 May 2012 Pages: 2118 - 2125
Impurity Band Effects in Thermoelectric Materials H. J. Goldsmid OriginalPaper 10 May 2012 Pages: 2126 - 2129
Analysis of Interface Scattering in AlGaN/GaN/InGaN/GaN Double-Heterojunction High-Electron-Mobility Transistors Lin WangWeida HuWei Lu OriginalPaper 31 May 2012 Pages: 2130 - 2138
Effect of Nitridation on the Regrowth Interface of AlGaN/GaN Structures Grown by Molecular Beam Epitaxy on GaN Templates Yuen-Yee WongWei-Ching HuangEdward Yi Chang OriginalPaper 06 June 2012 Pages: 2139 - 2144
Electrical Characteristics of Ti/Al Ohmic Contacts to Molecular Beam Epitaxy-Grown N-polar n-type GaN for Vertical-Structure Light-Emitting Diodes Joon-Woo JeonTae-Yeon SeongGon Namgoong OriginalPaper 31 May 2012 Pages: 2145 - 2150
ZnO Grown on (111) ZnS Substrates by Plasma-Assisted Molecular Beam Epitaxy Kuaile ZhaoShaoping WangA. Shen OriginalPaper 31 May 2012 Pages: 2151 - 2154
Low-Temperature Synthesis of Fe-Doped ZnO Nanotubes Gopal SapkotaKarol GryczynskiU. Philipose OriginalPaper 31 May 2012 Pages: 2155 - 2161
Fabrication of Bistable Switching Memory Devices Utilizing Polymer–ZnO Nanocomposites A. KathalingamJin-Koo Rhee OriginalPaper 26 May 2012 Pages: 2162 - 2168
Laser Trimming of CuAlMo Thin-Film Resistors: Effect of Laser Processing Parameters Martin BirkettRoger Penlington OriginalPaper 10 May 2012 Pages: 2169 - 2177
Effect of Cu Substitution on the Magnetic Properties of SmCo5 Film with Perpendicular Magnetic Anisotropy Weiming ChengYifan DaiXiangshui Miao OriginalPaper 31 May 2012 Pages: 2178 - 2183
Fabrication and Circuit Modeling of NMOS Inverter Based on Quantum Dot Gate Field-Effect Transistors Supriya KarmakarJohn A. ChandyFaquir C. Jain OriginalPaper 10 May 2012 Pages: 2184 - 2192
Tunneling Atomic Force Microscopy Studies on Surface Growth Pits Due to Dislocations in 4H-SiC Epitaxial Layers Noboru OhtaniShoji UshioWataru Ohashi OriginalPaper 31 May 2012 Pages: 2193 - 2196
Physical and Electrical Properties of Dy2O3 and Dy2TiO5 Metal Oxide–High-κ Oxide–Silicon-Type Nonvolatile Memory Devices Fa-Hsyang ChenTung-Ming Pan OriginalPaper 09 May 2012 Pages: 2197 - 2203
Optical and Electrical Properties of Cu2ZnSnS4 Film Prepared by Sulfurization Method Feng JiangHonglie ShenWei Wang OriginalPaper 15 May 2012 Pages: 2204 - 2209
A Comparative Study of Co-electrodeposited Cu2ZnSnS4 Absorber Material on Fluorinated Tin Oxide and Molybdenum Substrates Prashant K. SarswatMichael L. Free OriginalPaper 03 April 2012 Pages: 2210 - 2215
The Effect of Heat Treatment on Structural and Multiferroic Properties of Phase-Pure BiFeO3 M. Yasin ShamiM.S. AwanM. Anis-ur-Rehman OriginalPaper 31 May 2012 Pages: 2216 - 2224
High-Temperature Oxidation Behavior of Filled Skutterudites Yb y Co4Sb12 Xugui XiaPengfei QiuLidong Chen OriginalPaper 03 April 2012 Pages: 2225 - 2231
Effects of Ethylenediamine Tetraacetic Acid on the Texture and Magnetic Properties of Barium Ferrite Films Fang LiWanli ZhangWenxu Zhang OriginalPaper 19 May 2012 Pages: 2232 - 2237
Enhancing Piezoelectric Performance of CaBi2Nb2O9 Ceramics Through Microstructure Control Huanbei ChenJiwei Zhai OriginalPaper 30 March 2012 Pages: 2238 - 2242
Effects of Frequency on AC Conductivity and Magnetoresistance in Doped La0.65Ca0.35MnO3 Manganites Wiqar Hussain ShahAkif Safeen OriginalPaper 13 April 2012 Pages: 2243 - 2249
Effect of Mn and Nb Doped BaTiO3 in the Dielectric Properties in the Ba(Mn1/2Nb1/2)xTi1−xO3 Faiza BoujelbenH. KhemakhemA. Simon OriginalPaper 31 May 2012 Pages: 2250 - 2255
Development of Metallic Hermetic Sealing for MEMS Packaging for Harsh Environment Applications Vivek ChidambaramHo Beng YeungGao Shan OriginalPaper 17 May 2012 Pages: 2256 - 2266
Metal/PET Composite Knitted Fabrics and Composites: Structural Design and Electromagnetic Shielding Effectiveness Chen-Hung HuangJia-Horng LinChing-Wen Lou OriginalPaper 01 June 2012 Pages: 2267 - 2273
Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150°C and Atmospheric Pressure Akitsu ShigetouTadatomo Suga OriginalPaper 13 April 2012 Pages: 2274 - 2280
Dielectric and Thermal Properties of Polyimide–Poly(ethylene oxide) Nanofoamed Films Yi-He ZhangLi YuH. L. W. Chan OriginalPaper 25 April 2012 Pages: 2281 - 2285
Embedded Capacitors in Printed Wiring Board: A Technological Review Mohammed A. AlamMichael H. AzarianMichael G. Pecht ReviewPaper 07 April 2012 Pages: 2286 - 2303
Erratum to: Electrical Characteristics of Ti/Al Ohmic Contacts to Molecular Beam Epitaxy-Grown N-polar n-type GaN for Vertical-Structure Light-Emitting Diodes Joon-Woo JeonTae-Yeon SeongGon Namkoong Erratum 16 June 2012 Pages: 2304 - 2304
Erratum to: Effects of Pulsed Laser Deposition Conditions on the Microstructure of Ca3Co4O9 Thin Films Ting SunHuey Hoon HngJan Ma Erratum 26 May 2012 Pages: 2305 - 2305
