Fabrication of Metal–Oxide–Diamond Field-Effect Transistors with Submicron-Sized Gate Length on Boron-Doped (111) H-Terminated Surfaces Using Electron Beam Evaporated SiO2 and Al2O3 Takeyasu SaitoKyung-ho ParkHideyo Okushi OriginalPaper 03 February 2011 Pages: 247 - 252
Local Piezoelectricity and Polarity Distribution of Preferred c-Axis-Oriented ZnO Film Investigated by Piezoresponse Force Microscopy Cui Ping LiBao He Yang OriginalPaper 19 November 2010 Pages: 253 - 258
Tailoring the Structural and Optoelectronic Properties of Al-Doped Nanocrystalline ZnO Thin Films C. PeriasamyP. Chakrabarti OriginalPaper 02 December 2010 Pages: 259 - 266
The Influence of Film Thickness on the Transparency and Conductivity of Al-Doped ZnO Thin Films Fabricated by Ion-Beam Sputtering Guang-Xing LiangPing FanZhuang-Hao Zheng OriginalPaper 29 January 2011 Pages: 267 - 273
Point Defects in CdZnTe Crystals Grown by Different Techniques R. GulA. BolotnikovR. B. James OriginalPaper 02 February 2011 Pages: 274 - 279
The Distribution Tail of LWIR HgCdTe-on-Si FPAs: a Hypothetical Physical Mechanism L. O. BubulacJ.D. BensonD. Rhiger OriginalPaper 02 February 2011 Pages: 280 - 288
Study of the Formation Mechanism of Cu/Ge/Pd Ohmic Contact to n-Type InGaAs Y. C. LinSheng-Li ShieE. Y. Chang OriginalPaper 19 November 2010 Pages: 289 - 294
Electrical Conductivity of Parylene F at High Temperature S. DiahamM. BecharaC. Tenailleau OriginalPaper 19 November 2010 Pages: 295 - 300
Laser Direct Writing of Conductive Silver Film on Polyimide Surface from Decomposition of Organometallic Ink Zhixiang CaiXiaoyan ZengJianguo Liu OriginalPaper 19 November 2010 Pages: 301 - 305
Interfacial Reactions of Sn-3.5Ag-xZn Solders and Cu Substrate During Liquid-State Aging Lijuan LiuWei ZhouPing Wu OriginalPaper 23 December 2010 Pages: 306 - 314
Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn-xAg/Cu Joints M. L. HuangY. Z. HuangJ. Zhao OriginalPaper 23 December 2010 Pages: 315 - 323
Effects of Bonding Temperature and Pressure on the Electrical Resistance of Cu/Sn/Cu Joints for 3D Integration Applications Byunghoon LeeJongseo ParkHoo-jeong Lee OriginalPaper 23 December 2010 Pages: 324 - 329
An Investigation of Diffusion Barrier Characteristics of an Electroless Co(W,P) Layer to Lead-Free SnBi Solder Hung-Chun PanTsung-Eong Hsieh OriginalPaper 05 January 2011 Pages: 330 - 339
Preparation of Bi0.85Nd0.15FeO3 Nanotube Arrays by a Sol–Gel Template Method Dongyun GuoYiping GongLianmeng Zhang OriginalPaper 06 January 2011 Pages: 340 - 343
Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition F. X. CheW. H. ZhuS. Gao OriginalPaper 03 February 2011 Pages: 344 - 354
Dielectric Properties and Microstructure of MgO-TiO2-ZnO-CaO Ceramics Yonggang ZhangShunhua WuShunqi Gao BriefCommunication 23 December 2010 Pages: 355 - 360