Formation of Hybrid Inorganic/Organic Nanocomposites Tamara V. BasovaNadezhda M. KurochkinaAsim K. Ray OriginalPaper 15 December 2009 Pages: 145 - 148
Photodefinable Epoxycyclohexyl Polyhedral Oligomeric Silsesquioxane Nathan FritzRajarshi SahaPaul A. Kohl OriginalPaper 24 December 2009 Pages: 149 - 156
Using Phosphorus-Doped α-Si Gettering Layers to Improve NILC Poly-Si TFT Performance Bau-Ming WangYewChung Sermon Wu OriginalPaper 29 December 2009 Pages: 157 - 161
Chemical Vapor Deposition of α-Boron Layers on Silicon for Controlled Nanometer-Deep p + n Junction Formation Francesco SarubbiTom L. M. ScholtesLis K. Nanver OriginalPaper Open access 11 December 2009 Pages: 162 - 173
Compositional and Strain Characterization of Ion-Beam-Synthesized Ge x Si1−x Thin Films K. HossainV. C. KummariF. D. McDaniel OriginalPaper 29 December 2009 Pages: 174 - 177
Comparison of Bowing Behaviors Between III–V and II–VI Common-Cation Semiconductor Ternary Alloys Nacir TitNoureddine AmraneAli Hussain Reshak OriginalPaper 11 November 2009 Pages: 178 - 186
Preparation and Characterization of Epitaxial Conductive Nb-SrTiO3 Thin Films on Si Substrates Chun Wang OriginalPaper 30 September 2009 Pages: 187 - 190
Evolution of Annealing Twins in Sputtered Cu Films C. K. YoonD. P. Field OriginalPaper 26 November 2009 Pages: 191 - 199
Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints Hsiu-Jen LinTung-Han Chuang OriginalPaper 30 September 2009 Pages: 200 - 208
Interfacial Reactions Between Sn-Zn Alloys and Ni Substrates WenJun ZhuHuaShan LiuZhanPeng Jin OriginalPaper 07 October 2009 Pages: 209 - 214
Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3 Particles M. KangooieR. MahmudiA.R. Geranmayeh OriginalPaper 05 November 2009 Pages: 215 - 222
Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder Y.D. HanH.Y. JingJ. Wei OriginalPaper 05 November 2009 Pages: 223 - 229
Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging Chi-Yang YuKai-Jheng WangJenq-Gong Duh OriginalPaper 18 November 2009 Pages: 230 - 237
Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint Yoshihiko KandaYoshiharu Kariya OriginalPaper 26 November 2009 Pages: 238 - 245
Thermodynamic Descriptions for the Sn-Te and Pb-Sn-Te Systems Yajun LiuDong LiangLijun Zhang OriginalPaper 18 November 2009 Pages: 246 - 257
Preparation and Ferroelectric Properties of Ho3+/Mo6+ Cosubstituted Bi4Ti3O12 Thin Films by Sol–Gel Method Chengju FuZhixiong HuangDongyun Guo OriginalPaper 10 November 2009 Pages: 258 - 261