InAlSb/InAs/AlGaSb Quantum Well Heterostructures for High-Electron-Mobility Transistors Brian R. BennettJ. Brad BoosH. Kheyrandish Regular Issue Paper 31 January 2007 Pages: 99 - 104
Wafer-Lever Hermetic Package with Through-Wafer Interconnects Wang Yu-ChuanZhu Da-PengLe Luo OriginalPaper 26 January 2007 Pages: 105 - 109
Impact of Thermal, Moisture, and Mechanical Loading Conditions on Interfacial Fracture Toughness of Adhesively Bonded Joints Shane LooXueren ZhangS. G. Mhaisalkar Regular Issue Paper 31 January 2007 Pages: 110 - 116
Local Melting during Electromigration in Cu Conductor Lines H. ZhangG. WangG. S. Cargill III Regular Issue Paper 31 January 2007 Pages: 117 - 122
Electrical Characteristics of the Three-Dimensional Interconnection Structure for the Chip Stack Package with Cu through Vias Kwang-Yong LeeTeck-Su OhTae-Sung Oh OriginalPaper 09 January 2007 Pages: 123 - 128
Structural and Passivative Behaviors of Cu(In) Thin Film J. S. FangH. Y. Hsieh OriginalPaper 28 December 2006 Pages: 129 - 135
Solder/Substrate Interfacial Reactions in the Sn-Cu-Ni Interconnection System H. YuV. VuorinenJ. K. Kivilahti Regular Issue Paper 17 January 2007 Pages: 136 - 146
Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples Yee-Wen YenChien-Chung JaoChiapyng Lee OriginalPaper 09 January 2007 Pages: 147 - 158
Three-Dimensional Thermoelectrical Simulation in Flip-Chip Solder Joints with Thick Underbump Metallizations during Accelerated Electromigration Testing S.W. LiangY.W. ChangChih Chen OriginalPaper 31 January 2007 Pages: 159 - 167
Electromigration-Induced Bi Segregation in Eutectic SnBi Solder Joint Chih-Ming ChenLong-Tai ChenYa-Shiu Lin Regular Issue Paper 11 January 2007 Pages: 168 - 172
Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C Tia-Marje K. KorhonenLawrence P. LehmanDonald W. Henderson Special Issue Paper 31 January 2007 Pages: 173 - 178