Seeded growth of AlN crystals on nonpolar seeds via physical vapor transport D. ZhuangZ. G. HerroZ. Sitar OriginalPaper Pages: 1513 - 1517
Lead-free solder reinforced with multiwalled carbon nanotubes S. M. L. NaiJ. WeiM. Gupta OriginalPaper Pages: 1518 - 1522
Influence of bias-temperature stressing on the electrical characteristics of SiOC:H film with Cu/TaN/Ta-gated capacitor Kou-Chiang TsaiWen-Fa WuChuen-Guang Chao OriginalPaper Pages: 1523 - 1529
Effect of flux on the wetting characteristics of SnAg, SnCu, SnAgBi, and SnAgCu lead-free solders on copper substrates Mario F. ArenasMin HeViola L. Acoff OriginalPaper Pages: 1530 - 1536
Three-dimensional analysis of the interface between an Sn-8wt.%Zn-3wt.%Bi solder and a substrate by using an angle-lapping method Nobuhiro IshikawaTakashi KimuraTakashi Sugizaki OriginalPaper Pages: 1537 - 1542
Structural defects in Si-doped III–V nitrides Dmitri N. ZakharovZuzanna Liliental-WeberEvelyn Hu OriginalPaper Pages: 1543 - 1546
Annealing effect on the dc transport mechanism in dysprosium oxide films grown on Si substrates A. A. Dakhel OriginalPaper Pages: 1547 - 1551
Influence of substrate temperature on the properties of fluorinated silicon-nitride thin films deposited by IC-RPECVD J. FandiñoA. López-SuárezA. Oliver OriginalPaper Pages: 1552 - 1557
Interfacial adhesion of spin-coated thin adhesive film on silicon substrate for the fabrication of polymer optical waveguide M. A. UddinW. F. HoH. P. Chan OriginalPaper Pages: 1558 - 1565
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer Tung-Han ChuangHsiu-Jen LinCheng-Wen Tsao OriginalPaper Pages: 1566 - 1570
Durable electrochromic coatings prepared from electronically conductive poly(3HT-co-3TPP)-silica hybrid materials Yuan-Hsiang YuCheng-Yuan LaiJui-Ming Yeh OriginalPaper Pages: 1571 - 1580
Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates N. DariavachP. CallahanR. Fournelle OriginalPaper Pages: 1581 - 1592
Investigation of electroless cobalt-phosphorous layer and its diffusion barrier properties of Pb-Sn solder Muh-Wang LiangHui-Ting YenTsung-Eong Hsieh OriginalPaper Pages: 1593 - 1599
Microstructure, creep properties, and failure mechanism of SnAgCu solder joints Janne J. SundelinSami T. NurmiEero O. Ristolainen OriginalPaper Pages: 1600 - 1606
High-pressure preparation and thermoelectric properties of Bi0.85Sb0.15 H. J. LiuL. F. LiDongliu Shi OriginalPaper Pages: L7 - L10