Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys A. U. TelangT. R. BielerE. J. Cotts Special Issue Paper Pages: 1412 - 1423
Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints C. M. TsaiW. C. LuoC. R. Kao Special Issue Paper Pages: 1424 - 1428
Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder L. P. LehmanS. N. AthavaleE. J. Cotts Special Issue Paper Pages: 1429 - 1439
The application of lead-free solder to optical fiber packaging Shengquan OuGu XuK. N. Tu Special Issue Paper Pages: 1440 - 1444
Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying Szu-Tsung KaoJenq-Gong Duh Special Issue Paper Pages: 1445 - 1451
Contact angle measurements of Sn-Ag and Sn-Cu lead-free solders on copper substrates Mario F. ArenasViola L. Acoff Special Issue Paper Pages: 1452 - 1458
The effects of electroplating parameters on the composition and morphology of Sn-Ag solder J. Y. KimJ. YuT. Y. Lee Special Issue Paper Pages: 1459 - 1464
Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization Zhong ChenMin HeGuojun Qi Special Issue Paper Pages: 1465 - 1472
Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II—Aged condition Paul T. ViancoJerome A. RejentAlice C. Kilgo Special Issue Paper Pages: 1473 - 1484
Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength I. E. AndersonJ. L. Harringa Special Issue Paper Pages: 1485 - 1496
Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate Y. QiA. R. ZbrzeznyJ. K. Spelt Special Issue Paper Pages: 1497 - 1506
Effects of load and thermal conditions on Pb-free solder joint reliability J. LiangS. DownesS. M. Heinrich Special Issue Paper Pages: 1507 - 1515
Ceramics bonding using solder glass frit Z. SunD. PanC. K. Wong Special Issue Paper Pages: 1516 - 1523
Intermetallic phase detection in lead-free solders using synchrotron x-ray diffraction Gavin J. JacksonHua LuJon Wright Special Issue Paper Pages: 1524 - 1529
Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging Sang Won JeongJong Hoon KimHyuck Mo Lee Special Issue Paper Pages: 1530 - 1544
Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy A. LaLondeD. EmelanderD. W. Henderson Special Issue Paper Pages: 1545 - 1549
Interfacial reaction study on a solder joint with Sn-4Ag-0.5Cu solder ball and Sn-7Zn-Al (30 ppm) solder paste in a lead-free wafer level chip scale package Huann-Wu ChiangJun-Yuan ChenS. M. Li Special Issue Paper Pages: 1550 - 1556
Intermetallic compounds and adhesion strength between the Sn-9Zn-1.5Ag-0.5Bi lead-free solder and unfluxed Cu substrate Chih-Yao LiuMoo-Chin WangMin-Hsiung Hon Special Issue Paper Pages: 1557 - 1560
The effect of isothermal aging on the thickness of intermetallic compound layer growth between low melting point solders and Ni-plated Cu substrate Dae-Gon KimSeung-Boo Jung Special Issue Paper Pages: 1561 - 1566
A dynamic model for the assessment of the replacement of lead in solders Markus A. ReuterEwoud V. Verhoef Special Issue Paper Pages: 1567 - 1580
Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates Tia-Marje K. KorhonenPekka TurpeinenKarl J. Puttlitz Special Issue Paper Pages: 1581 - 1588
An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation N. ChawlaY. -L. ShenE. S. Ege Special Issue Paper Pages: 1589 - 1595
Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy F. OchoaX. DengN. Chawla Special Issue Paper Pages: 1596 - 1607
