Magnetics and magnetoresistance in epitaxial magnetite heterostructures R. V. ChopdekarG. HuY. Suzuki Special Issue Paper Pages: 1254 - 1258
Magnetoresistance and magnetization studies of the layered magnanite system La1.2Ca1.8Mn2−xRuxO7 (0 ≤ x ≤ 1) Nori SudhakarK. P. Rajeev Special Issue Paper Pages: 1259 - 1263
Enhancement of ferromagnetism in the colossal-magnetoresistance layered manganite La1.2Ba1.8Mn2−xRuxO7 (x = 0, 0.1, 0.5, and 1) Nori SudhakarK. P. RajeevA. K. Nigam Special Issue Paper Pages: 1264 - 1268
A novel magnetic random access memory design using square ring elements for the hard layer Dwarakanath N. GeerpuramAnand S. ManiVidhya Shankar Baskaran Special Issue Paper Pages: 1269 - 1273
Probing tunnel barrier shape and its effects on inversed tunneling magnetoresistance at high bias Wen-Ting ShengW. G. WangJohn Q. Xiao Special Issue Paper Pages: 1274 - 1279
Electrical and magnetoresistance properties of composites consisting of iron nanoparticles within the hexaferrites C. SudakarT. R. N. Kutty Special Issue Paper Pages: 1280 - 1288
Mechanical alloying of FeCo Nanocrystalline magnetic powders H. F. LiR. V. Ramanujan Special Issue Paper Pages: 1289 - 1297
Origin of room-temperature ferromagnetism in cobalt-doped ZnO S. RamachandranAshutosh TiwariJ. Narayan Special Issue Paper Pages: 1298 - 1302
Destruction of an orbitally ordered and spin-polarized state: Colossal magnetoresistance in Ca3Ru2O7 G. CaoL. BalicasJ. E. Crow Special Issue Paper Pages: 1303 - 1307
Etching of 4H-SiC using a NF3 inductively coupled plasma Byungwhan KimByung-Teak Lee Special Issue Paper Pages: 1308 - 1312
The solid solubility of Ag and Cu in the Sn phase of eutectic and near-eutectic Sn-Ag-Cu solder alloys L. SnugovskyC. CermignaniJ. W. Rutter Special Issue Paper Pages: 1313 - 1315
Burnout of the organic vehicle in an electrically conductive thick-film paste Zongrong LiuD. D. L. Chung Special Issue Paper Pages: 1316 - 1325
Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate Hai DongKyoung-Sik MoonC. P. Wong Special Issue Paper Pages: 1326 - 1330
Isotropic conductive adhesives with fusible filler particles Jong-Min KimKiyokazu YasudaKozo Fujimoto Special Issue Paper Pages: 1331 - 1337
Partitioned viscoplastic-constitutive properties of the Pb-free Sn3.9Ag0.6Cu solder Qian ZhangAbhijit DasguptaPeter Haswell Special Issue Paper Pages: 1338 - 1349
Thermal gradient in solder joints under electrical-current stressing T. L. ShaoS. H. ChiuC. Y. Hsu Special Issue Paper Pages: 1350 - 1354
Effect of cooling rate on microstructure and shear strength of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-37Pb solders J. G. MaveetyP. LiuE. A. Sanchez Special Issue Paper Pages: 1355 - 1362
Microstructure and texture of free-standing Cu-line patterns Karen PantleonMarcel A. J. Somers Special Issue Paper Pages: 1363 - 1372
Aging study on interfacial microstructure and solder-ball shear strength of a wafer-level chip-size package with Au/Ni metallization on a Cu pad Kuo-Chin ChangKuo-Ning Chiang Special Issue Paper Pages: 1373 - 1380
Stabilizing contact resistance of isotropically conductive adhesives on various metal surfaces by incorporating sacrificial anode materials Kyoung-Sik MoonSilvia LiongC. P. Wong Special Issue Paper Pages: 1381 - 1388
Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder—Part I: As-cast condition Paul T. ViancoJerome A. RejentAlice C. Kilgo Special Issue Paper Pages: 1389 - 1400
Influence of GaN material characteristics on device performance for blue and ultraviolet light-emitting diodes D. W. MerfeldX. A. CaoM. P. D’Evelyn Special Issue Paper Pages: 1401 - 1405
Ohmic contacts to n-type GaSb and n-type GalnAsSb Robin K. HuangChristine A. WangDaniel A. Shiau Special Issue Paper Pages: 1406 - 1410