Wide and narrow bandgap semiconductors for power electronics: A new valuation Jerry L. Hudgins Regular Issue Paper Pages: 471 - 477
Optimization of pretreatment for liquid-phase deposition of SiO2 on ARTON plastic substrate C. J. HuangW. C. Shih Regular Issue Paper Pages: 478 - 482
Interfacial microstructure and intermetallics developed in the interface between in solders and Au/Ni/Ti thin films during reflow process Keesam ShinWon-Gu ChoYoung-Ho Kim Regular Issue Paper Pages: 483 - 491
Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devices A. K. ChuJ. Y. LinS. F. Lin Regular Issue Paper Pages: 492 - 495
Analysis of physical properties of III-nitride thin films by nanoindentation Sheng-Rui JianTe-Hua FangDer-San Chuu Regular Issue Paper Pages: 496 - 500
Investigation of Ti/Al and TiN/Al thin films as the stable ohmic contact for p-type 4H-SiC Byung-Teak LeeJong-Yoon ShinJong Lam Lee Regular Issue Paper Pages: 501 - 504
High resistivity measurement of SiC wafers using different techniques P. G. MuzykovY. I. KhlebnikovT. S. Sudarshan Regular Issue Paper Pages: 505 - 510
Electron backscattered diffraction and energy dispersive X-ray spectroscopy study of the phase NiSn4 W. J. BoettingerM. D. VaudinW. R. Wagner Regular Issue Paper Pages: 511 - 515
Adhesion strength of the Sn-9Zn-xAg/Cu interface Tao-Chih ChangMin-Hsiung HonMoo-Chin Wang Regular Issue Paper Pages: 516 - 522
Effect of dwell times on thermomechanical fatigue behavior of Sn-Ag-based solder joints J. G. LeeK. N. Subramanian Regular Issue Paper Pages: 523 - 530
Activation energy determination for recrystallization in electroplated-copper films using differential scanning calorimetry Suresh K. DonthuMehul M. VoraS. Yi Regular Issue Paper Pages: 531 - 534
Predicting tensile properties of the bulk 96.5Sn-3.5Ag lead-free solder Yi-Wen ChengThomas A. Siewert Regular Issue Paper Pages: 535 - 540
Creep rupture of lead-free Sn-3.5Ag-Cu solders D. K. JooJin YuS. W. Shin Regular Issue Paper Pages: 541 - 547
A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy Young-Doo JeonSabine NielandKyung-Wook Paik Regular Issue Paper Pages: 548 - 557
Optimization of black oxide coating thickness as an adhesion promoter for copper substrate in plastic integrated-circuit packages Mohamed LebbaiJang-Kyo KimPin Tong Regular Issue Paper Pages: 558 - 563
Effects of dimple and metal coating on interfacial adhesion in plastic packages M. LebbaiJang-Kyo KimMatthew M. F. Yuen Regular Issue Paper Pages: 564 - 573
Effects of moisture and elevated temperature on reliability of interfacial adhesion in plastic packages M. LebbaiJang-Kyo KimMatthew M. F. Yuen Regular Issue Paper Pages: 574 - 582
Positron-defect profiling in Cd1−xZnxTe wafers after saw cutting Sean P. McneilKelvin G. LynnRaji Soundararajan Regular Issue Paper Pages: 583 - 585