Investigation of carrier relaxation dynamics in single CdSe/ZnSe self-organized quantum dot by time-resolved micro-photoluminescence Takeshi OtaYasuhiro MuraseKazuo Murase Special Issue Paper Pages: 448 - 452
Effects of mismatch strain and alloy composition on the formation of InAs islands on InAlAs templates Y. CordierP. MiskaD. Ferre Special Issue Paper Pages: 453 - 458
Photoluminescence of InAs quantum dots coupled to a two-dimensional electron gas Y. H. LuoJ. WanK. L. Wang Special Issue Paper Pages: 459 - 462
Interface structure and growth mode of quantum wire and quantum dot GaAs-AlAs structures on corrugated (311)A surfaces N. N. LedentsovD. LitvinovZh. I. Alferov Special Issue Paper Pages: 463 - 470
Growth and characterizations of InP self-assembled quantum dots embedded in InAIP grown on GaAs substrates Jae-Hyun RyouRussell D. DupuisJames L. Merz Special Issue Paper Pages: 471 - 476
1.3 μm GaAs-based quantum well and quantum dot lasers: Comparative analysis A. Yu. EgorovA. E. ZhukovV. M. Ustinov Special Issue Paper Pages: 477 - 481
Electron beam pre-patterning for site-control of self-assembled InAs quantum dots on Inp surfaces M. BorgströmT. BryllertL. Samuelson Special Issue Paper Pages: 482 - 486
Annealing temperature dependence of electric conduction and capacitance dispersion in nitrogen-implanted GaAs J. F. ChenM. M. HuangJ. S. Wang Regular Issue Paper Pages: 487 - 492
Amorphous Ta-nanocrystalline RuOx diffusion barrier for lower electrode of high density memory devices Dong-Soo YoonHong Koo BaikJae Sung Roh Regular Issue Paper Pages: 493 - 502
Characterization of nano-wear mechanisms of hard disk coatings Woo Seok KimJang-Kyo KimPyung Hwang Regular Issue Paper Pages: 503 - 512
Influence of alloy composition on fillet-lifting phenomenon in tin binary alloys H. TakaoH. Hasegawa Regular Issue Paper Pages: 513 - 520
Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer C. Y. LiuJian LiK. N. Tu Regular Issue Paper Pages: 521 - 525
Al-enhanced PECVD SiNx induced hydrogen passivation in string ribbon silicon V. YelundurA. RohatgiR. L. Wallace Regular Issue Paper Pages: 526 - 531
Low resistive ohmic contact formation on surface treated-n-GaN alloyed at low temperature Yow-Jon LinHsin-Ying LeeChing-Ting Lee Regular Issue Paper Pages: 532 - 537
Characterization of the CH4/H2/Ar high density plasma etching process for ZnSe C. R. EddyD. LeonhardtJ. E. Butler Regular Issue Paper Pages: 538 - 542
Wettability of electroless Ni in the under bump metallurgy with lead free solder Bi-Lian YoungJenq-Gong DuhBi-Shiou Chiou Regular Issue Paper Pages: 543 - 553
Enhanced dielectric properties of Zr−Sn−Ti oxynitride thin films X. B. LuZ. G. Liu Regular Issue Paper Pages: 554 - 557
Critical thickness of high-temperature AIN interlayers in GaN on sapphire (0001) A. M. SanchezF. J. PachecoJ. Graul Letter Pages: L17 - L20
Laser-assisted via hole metallization in PCB materials K. KordásJ. BékésiL. Nánai Letter Pages: L21 - L24