Formation of Au nanoparticles on Si bicrystals C. H. LiuW. W. WuL. J. Chen OriginalPaper Pages: 2 - 6
Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder Yung-Chi LinJenq-Gong DuhBi-Shiou Chiou OriginalPaper Pages: 7 - 14
Crystallization and failure behavior of Ta-TM (TM=Fe, Co) nanostructured/amorphous diffusion barriers for copper metallization J. S. FangT. P. HsuG. S. Chen OriginalPaper Pages: 15 - 21
Interfacial reactions and phase equilibria in the Al-Cu/Ta systems Chin-Yi ChouSinn-Wen Chen OriginalPaper Pages: 22 - 27
Study of wetting reaction between eutectic AuSn and Au foil Y. T. LaiC. Y. Liu OriginalPaper Pages: 28 - 34
Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging Moon Gi ChoKyung Wook PaikTae-Gyu Kim OriginalPaper Pages: 35 - 40
Effects of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems Keun-Soo KimToshinori MatsuuraKatsuaki Suganuma OriginalPaper Pages: 41 - 47
Solid-state phase formation between Pd thin films and GaSb J. A. RobinsonS. E. Mohney OriginalPaper Pages: 48 - 55
Phase field simulations of morphological evolution and growth kinetics of solder reaction products K. K. HongJ. Y. Huh OriginalPaper Pages: 56 - 64
Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates J. Y. TsaiC. W. ChangC. R. Kao OriginalPaper Pages: 65 - 71
Interfacial reactions in the pb-free composite solders with indium layers Sinn-Wen ChenShih-Kang LinChing-Feng Yang OriginalPaper Pages: 72 - 75
Thermal performance of sputtered insoluble Cu(W) films for advanced barrierless metallization J. P. ChuC. H. LinY. Y. Hsieh OriginalPaper Pages: 76 - 80
Characterizing metallurgical reaction of Sn3.0Ag0.5Cu composite solder by mechanical alloying with electroless Ni-P/Cu under-bump metallization after various reflow cycles Li-Yin HsiaoSzu-Tsung KaoJenq-Gong Duh OriginalPaper Pages: 81 - 88
Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys C. M. T. LawC. M. L. WuJ. K. L. Lai OriginalPaper Pages: 89 - 93
Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints I. E. AndersonJ. L. Harringa OriginalPaper Pages: 94 - 106
Effect of KOH treatment on the schottky barrier height and reverse leakage current in Pt/n-GaN Ho Gyoung KimSang Ho KimTim Sands OriginalPaper Pages: 107 - 112
The effects of hydrogen on aluminum-induced crystallization of sputtered hydrogenated amorphous silicon Maruf HossainHusam H. Abu-SafeWilliam D. Brown OriginalPaper Pages: 113 - 117
Improving the electrical and mechanical behavior of electrically conductive paint by partial replacement of silver by carbon black Chia-Ken LeongD. D. L. Chung OriginalPaper Pages: 118 - 122
Microwave preheating of anisotropic conductive adhesive films for high-speed flip chip on flex bonding Rashed Adnan IslamY. C. Chan OriginalPaper Pages: 123 - 131
A quantitative evaluation of time-independent and time-dependent deformations of lead-free and lead-containing solder alloys Ken-Ichi OhguchiKatsuhiko SasakiMasahiro Ishibashi OriginalPaper Pages: 132 - 139
The electrical behavior of nitro oligo(phenylene ethynylene)’s in pure and mixed monolayers Nabanita MajumdarN. Gergel-HackettJ. M. Tour OriginalPaper Pages: 140 - 146
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads Yu-Chih LiuWei-Hong LinTung-Han Chuang OriginalPaper Pages: 147 - 153
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads Hsiu-Jen LinTung-Han Chuang OriginalPaper Pages: 154 - 164
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates S. S. WangY. H. TsengT. H. Chuang OriginalPaper Pages: 165 - 169
Ultrathin CdSe nanowire field-effect transistors Anubhav KhandelwalDebdeep JenaMasaru K. Kuno OriginalPaper Pages: 170 - 172
Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires Ute GeißlerMartin Schneider-RamelowHerbert Reichl OriginalPaper Pages: 173 - 180
Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders M. L. HuangT. LoeherH. Reichl OriginalPaper Pages: 181 - 188
Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly J. W. HwangM. J. YimK. W. Paik Erratum Pages: 189 - 189
A simple constitutive model for ratcheting evolution of 63Sn-37Pb solder under multiaxial loading Xu ChenDe-Hua Yu OriginalPaper Pages: L1 - L4
