Using a chromatic-aberration correction system to achieve sub-1.6-nm resolutions of a focused-ion-beam microscope designed for characterization and processing V. A. ZhukovA. I. TitovA. V. Zav’yalova Nanolithography Pages: 279 - 287
Transformations of porous layers upon high-temperature annealing: Simulation T. B. GovorukhaA. V. ZverevZ. Sh. Yanovitskaya Simulation of Semiconductor Devices, Integrated Circuits, and Technological Processes Pages: 288 - 298
The algorithmic model of a pipelined analog-to-digital converter Yu. B. Rogatkin Device and Circuit Modeling Pages: 299 - 304
Strain transmission from a substrate to a piezoresistive mesa V. M. Lubimsky Thin Films Pages: 305 - 312
Control of the adhesion strength of thin metal films in multilayer structures Z. I. TaliashviliL. R. VardosanidzeA. N. Tavkhelidze Jr. Thin Films Pages: 313 - 320
Specific features of intensification of silicon etching in CF4/O2 plasma Yu. N. GrigoryevA. G. Gorobchuk Plasmochemical Etching Pages: 321 - 332
Aspect-ratio-independent anisotropic silicon etching in a plasma chemical cyclic process O. V. MorozovI. I. Amirov Plasmochemical Etching Pages: 333 - 341
Sample-and-hold circuits for high-speed A/D converters A. S. GumenyukYu. I. Bocharov Circuit Design Pages: 342 - 352