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Control of the adhesion strength of thin metal films in multilayer structures

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Abstract

Technology of the fabrication of multilayer structures with controllable adhesion interaction between metal films composing these structures is considered. Control of adhesion interaction was attained by modifying the surface of corresponding metal film until an adhesion bond appeared in vacuum and by changing technological parameters. The adhesion strength was evaluated by the temperature of structure splitting due to the difference in the coefficients of thermal expansion of the substrate and ultimate metal electrode. The analysis of surfaces prior to and after structure splitting was carried out optically using the Michelson interferometer.

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Authors and Affiliations

  1. Dzhavakhishvili State University of Tbilisi, pr. Chavchavadze 3, Tbilisi, 380028, Georgia

    Z. I. Taliashvili, L. R. Vardosanidze, L. B. Jangidze & A. N. Tavkhelidze Jr.

Authors
  1. Z. I. Taliashvili
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  2. L. R. Vardosanidze
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  3. L. B. Jangidze
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  4. A. N. Tavkhelidze Jr.
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Additional information

Original Russian Text © Z.I. Taliashvili, L.R. Vardosanidze, L.B. Jangidze, A.N. Tavkhelidze, Jr., 2007, published in Mikroelektronika, 2007, Vol. 36, No. 5, pp. 359–367.

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Taliashvili, Z.I., Vardosanidze, L.R., Jangidze, L.B. et al. Control of the adhesion strength of thin metal films in multilayer structures. Russ Microelectron 36, 313–320 (2007). https://doi.org/10.1134/S1063739707050058

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  • DOI: https://doi.org/10.1134/S1063739707050058

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