1. A model for the etching of silicon in SF₆/O₂ plasmas

   • K. R. Ryan
   • I. C. Plumb

   OriginalPaper Pages: 207 - 229

2. Spectroscopic diagnostics of temperature-controlled trench etching of silicon

   • Ole Krogh
   • Robert N. Carlile
   • Robert N. Nowlin

   OriginalPaper Pages: 231 - 246

3. Glow discharge deposition of silicon dioxide and aluminum oxide films: A kinetic model of the surface processes

   • C. Bourreau
   • Y. Catherine
   • P. Garcia

   OriginalPaper Pages: 247 - 260

4. A mass spectrometric analysis of CF₄/O₂ plasmas: Effect of oxygen concentration and plasma power

   • J. C. Martz
   • D. W. Hess
   • W. E. Anderson

   OriginalPaper Pages: 261 - 275

5. Plasma polymerization of carbosilanes: Tetramethylsilane as a model monomer for reactivity study of silylmethyl groups

   • A. M. Wróbel
   • G. Czeremuszkin
   • J. Kowalski

   OriginalPaper Pages: 277 - 289

6. Argon plasma transport properties at reduced pressures

   • Seungho Paik
   • E. Pfender

   OriginalPaper Pages: 291 - 304

7. Modeling of the plasma sintering process at reduced pressures

   • Seungho Paik
   • E. Pfender

   OriginalPaper Pages: 305 - 319

8. The temperature profiles in an argon plasma issuing into an argon atmosphere: A comparison of measurements and predictions

   • A. H. Dilawari
   • J. Szekely
   • C. B. Shaw

   OriginalPaper Pages: 321 - 337

9. Effect of quenching conditions on particle formation and growth in thermal plasma synthesis of fine powders

   • Shrikant V. Joshi
   • Qibin Liang
   • James A. Batdorf

   OriginalPaper Pages: 339 - 358

10. Arc characteristics in small-scale DC plasma arc furnaces using graphite cathodes

    • R. Knight
    • M. J. Murawa
    • K. J. Reide

    OriginalPaper Pages: 359 - 373