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Development of high strength Sn-Mg solder alloys with reasonable ductility

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Abstract

This study discussed the development of a series of new lead-free Sn-Mg solders by incorporating varying amounts of Mg (0.8, 1.5 and 2.5 wt. %) into pure Sn using disintegrated melt deposition technique followed by room temperature extrusion. All extruded Sn and Sn-Mg solder samples were characterized. Microstructural characterization studies revealed equiaxed grain morphology, minimal porosity and relatively uniform distribution of secondary phase. Better coefficient of thermal expansion was observed for Sn-2.5Mg sample when compared to conventional Sn-37Pb solder. Melting temperature of Sn-1.5Mg was found to be 212°C which is much lower than the conventional Sn-Ag-Cu or Sn-Cu (227°C) solders. Microhardness was increased with increasing amount of Mg in pure Sn. Room temperature tensile test results revealed that newly developed Sn-Mg solders exhibit enhanced strengths (0.2% yield strength and ultimate tensile strength) with comparable (if not better) ductility when compared to other commercially available and widely used Sn-based solder alloys.

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Authors and Affiliations

  1. Mechanical Engineering Technology, HBCC, King Fahd University of Petroleum and Minerals, P. O. Box: 1803, Hafr Al-Batin, 31991, KSA

    Md Ershadul Alam

  2. Department of Mechanical Engineering, National University of Singapore, 9 Engineering Drive 1, 117576, Singapore, Singapore

    Manoj Gupta

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  1. Md Ershadul Alam
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  2. Manoj Gupta
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Correspondence to Md Ershadul Alam.

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Alam, M.E., Gupta, M. Development of high strength Sn-Mg solder alloys with reasonable ductility. Electron. Mater. Lett. 9, 575–585 (2013). https://doi.org/10.1007/s13391-013-2168-5

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