Abstract
In this paper, we present a solution for understanding volume depletion and essentially decreasing the leakage current of β-Ga2O3 junctionless FETs (βJL-FETs) by embedding the 4H-SiC layer into the BOX layer (βESJL-FET). Using the silvaco simulator with 2-D simulations, we illustrate that the βESJL-FET with an embedded 4H-SiC layer shows a very high ION/IOFF ratio of ~1012 even for a 40 nm channel length. The main idea of this work focuses on changing the volume depletion for achieving a lower leakage current. Also, the other goal is obtaining the lower self-heating effect provided by replacing 4H-SiC with a higher thermal conductivity into the BOX layer. Although the silicon FETs are more applicable but, due to better performance at the ultra-scaled dimensions, we propose the β-Ga2O3 instead of silicon. Ga2O3 has a higher effective mass and lower bond distance than silicon and is suitable for short-channel devices.
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This manuscript has associated data in a data repository. [Authors’ comment: The data that support the findings of this study are available from the corresponding author, upon reasonable request.].
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Madadi, D. β-Ga2O3 Junctionless FET with an Ω Shape 4H-SiC Region in Accumulation Mode. Silicon 14, 7595–7602 (2022). https://doi.org/10.1007/s12633-021-01510-9
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DOI: https://doi.org/10.1007/s12633-021-01510-9