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Rotary Ultrasonic Drilling of Silica Glass BK-7: Microstructural Investigation and Process Optimization Through TOPSIS

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Abstract

Laser and optics industries, are continueosly looking for glasses that posses excellent optical properties. Silica based glass BK7 is emerging as the pragmatic solution to meet these industrial needs that too with low fabrication cost. Conventional machining processes find it hard to process BK7 due to high hardness and low fracture toughness. In order to overcome the practical barriers of all the alternative processes, rotary ultrasonic machining has been attempted for drilling BK7. Taguchi based L9 array has been used for experimentation. Feed rate, tool rotational speed and ultrasonic power have been chosen as input variables. The drilling efficacy was evaluated considering the chipping width (CW), Taper (T) and material removal rate (MRR) as output responses. Main effects plots were drawn to reveal the effect of process variables on performance indices. ANOVA was used to identify the significant factors. It also figured out the extent to which significant factors influence the output responses. As Taguchi approach is not capable of simultaneous optimization of responses, TOPSIS approach was coupled with it for multi-response optimization. The predicted optimal solution, feed 0.60 mm/min, tool RPM 5000 and ultrasonic power 70% yielded the superior performance. The dominance of feed over other input factors made it the most crucial factor. Fractography highlighted the mixed flow of material at low feed rate, giving rise to superior surface finish. All the findings were confirmed experimentally as well as statistically. All the predicted results were found finely tuned with experimental results during confirmation experiments at 95% confidence level.

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Abbreviations

CW:

Chipping width

T:

Taper

MRR:

Material removal rate

TRS:

Tool rotational speed

FR:

Feed rate

UP:

Ultrasonic power

ANOVA:

analysis of variance

USM:

Ultrasonic machining

RUM:

Rotary ultrasonic machining

RUD:

Rotary ultrasonic drilling

TOPSIS:

Technique for Order Preference by Similarity to Ideal Solution

S/N:

Signal to noise ratio

CWMEAN :

Mean value of chipping width

TMEAN :

Mean value of taper

MRRMEAN :

Mean value of material removal rate

S/NCW :

Signal to noise ratio for chipping width

S/NT :

Signal to noise ratio for taper

S/NMRR :

Signal to noise ratio for material removal rate

\( {\overline{CW}_m} \) :

Overall mean of chipping width

\( {\overline{T}_m} \) :

Overall mean of taper

\( {\overline{MRR}_m} \) :

Overall mean of material removal

S− :

Negative best solutions

S+ :

Positive best solutions

Dm:

Decision matrix

Nij :

Normalized decision matrix

U:

Weighted normalized matrix

\( {G}_{i}^{+} \) :

Distance of alternative from positive best solution

\( {G}_{i}^{-} \) :

Distance of alternative from negative best solution

PV:

Preference value

C.I.:

Confidence Interval

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Acknowledgements

The authors would like to acknowledge National Institute of Technology, Kurukshetra, India for providing requisite facilities to accomplish this work.

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  1. Department of Mechanical Engineering, National Institute of Technology Kurukshetra, Kurukshetra, India

    Vikas Kumar & Hari Singh

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  1. Vikas Kumar
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Correspondence to Vikas Kumar.

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Kumar, V., Singh, H. Rotary Ultrasonic Drilling of Silica Glass BK-7: Microstructural Investigation and Process Optimization Through TOPSIS. Silicon 11, 471–485 (2019). https://doi.org/10.1007/s12633-018-9933-x

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