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Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material

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Abstract

Sintered silver is a promising die-attach material capable of operating at temperatures of more than 200°C. However, while sintering reliably bonds Ag paste on Ag-plated substrate, reliability studies are needed to understand the behavior of this sintered bond on copper and direct bond copper (DBC) substrates. Here, we thermally cycled micron-Ag and nano-Ag joints created via sintering on Cu, DBC, and Ag-plated substrates between − 65°C and 150°C in order to understand their evolving microstructures and reliability. Short periods at high temperature did not oxidize the substrate, but the absence of copper oxides did not prevent adhesive failure of the nano-Ag joint at the Cu interface. We found that Ag filler size influences pore shapes, pore sizes, and shear strength; the micron-Ag joint produced a mixture of irregular and regular spherical pore shapes that reduced bond strength more than the predominantly spherical pores present in the nano-Ag joint.

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References

  1. K.S. Siow, J. Alloys Compd. 514, 6 (2012).

    Article  Google Scholar 

  2. K.S. Siow, J. Electron. Mater. 43, 947 (2014).

    Article  Google Scholar 

  3. A.S. Zuruzi and K.S. Siow, Electron. Mater. Lett. 11, 315 (2014).

    Google Scholar 

  4. K.S. Siow and Y.T. Lin, J. Electron. Packg. 138, 020804 (2016).

    Article  Google Scholar 

  5. L.S. Pei, B. Pan, H. Zhang, W. Ng, B. Wu, K.S. Siow, S. Sabne, and M. Tsuriya, in International Conference on Electronic Packaging Technology (IEEE Yamagata, Japan, 2017), p. 51.

  6. F. Yu, J. Cui, Z. Zhou, K. Fang, R.W. Johnson and M.C. Hamilton, IEEE Trans Power Elec. 32, 7083 (2017).

    Article  Google Scholar 

  7. S. Chua and K. Siow, J. Alloy Comp. 687, 486 (2016).

    Article  Google Scholar 

  8. T. Abeyasekerab and P. Rodriguez, Microelec. Rel. 51, 1903 (2011).

    Article  Google Scholar 

  9. A.A. Wereszczak, D.J. Vuono, H. Wang, M.K. Ferber, and Z. Liang, Properties of bulk sintered silver as a function of porosity (Oak Ridge National Lab., 2012), https://www.osti.gov/biblio/1041433/. Accessed 3 Oct 2018.

  10. N. Heuck, A. Langer, A. Stranz, G. Palm, R. Sittig, A. Bakin, and A. Waag, IEEE Trans. Comp. Pack. Manuf. Tech. 1, 1846 (2011).

    Article  Google Scholar 

  11. T. Herboth, C. Fruh, M. Gunther, and J. Wilde, in 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (Cascais, 2012).

  12. F. Le Henaff, G. Greca, P. Salerno, O. Mathieu, M. Reger, O. Khaselev, M. Boureghda, J. Durham, A. Lifton, and J.C. Harel, in Proceedings of PCIM Europe 2016; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (VDE: 2016), p. 1.

  13. C. Durand, M. Klingler, D. Coutellier, and H. Naceur, IEEE Trans. Dev. Mater. Rel. 16, 80 (2016).

    Article  Google Scholar 

  14. R. Mrossko, H. Oppermann, B. Wunderle, and B. Michel, in Proceedings of NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011 (Boston, MA, 2011), p. 149.

  15. L.A. Navarro, X. Perpiñà, P. Godignon, J. Montserrat, V. Banu, M. Vellvehi, and X. Jordà, IEEE Trans. Power Electron. 29, 2261 (2014).

    Article  Google Scholar 

  16. J.G. Bai and G.Q. Lu, IEEE Trans. Dev. Mater. Rel. 6, 436 (2006).

    Article  Google Scholar 

  17. S. Sakamoto, T. Sugahara, and K. Suganuma, J. Mater. Sci.: Mater. Electron. 24, 1332 (2013).

    Google Scholar 

  18. Y. Mei, G. Chen, X. Li, G.Q. Lu, and X. Chen, Solder Surface Mount Tech 25, 107 (2013).

    Article  Google Scholar 

  19. M. Knoerr, S. Kraft, and A. Schletz, in 12th Electronic Packaging Technology Conference (IEEE, Singapore, 2010), p. 56.

  20. R. Eisele, J. Rudzki, and M. Kock, in International Exhibition & Conference for Power Electronics, Intelligent Motion, Power Quality (Curran Associates Inc.: Nuremberg, Germany, 2007), p. 60.

  21. C. Weber, M. Hutter, S. Schmitz, and K.-D. Lang, in 65th Electronics and Computer Technology, (IEEE, San Diego, 2015), p. 1866.

  22. C. Chen, C. Choe, Z. Zhang, D. Kim, and K. Suganuma, J. Mat. Sci.: Mat. Electron. 29, 14335 (2018).

    Google Scholar 

  23. T. Herboth, M. Guenther, A. Fix, and J. Wilde, in 63rd IEEE Electronic Components and Technology Conference (IEEE, Las Vegas, 2013), p. 1621.

  24. P. Gadaud, V. Caccuri, D. Bertheau, J. Carr, and X. Milhet, Mat. Sci. Eng. A 669, 379 (2016).

    Article  Google Scholar 

  25. S.T. Chua, K. Siow, and A. Jalar, in 36th International Electronics Manufacturing Technology (IEEE, Johor Bahru, Malaysia, 2014), p. 1.

  26. Y.-H. Mei, J.-Y. Lian, X. Chen, G. Chen, X. Li, and G.-Q. LuIEEE Trans. Dev. Mat. Rel. 14, 194 (2014).

    Article  Google Scholar 

  27. S. Fu, Y. Mei, X. Li, P. Ning, and G.-Q. Lu, J. Electron. Mater. 44, 3973 (2015).

    Article  Google Scholar 

  28. N. Chawla and X. Deng, Mater. Sci. Eng., A 390, 98 (2005).

    Article  Google Scholar 

  29. G.C. Dong, X. Chen, G.Q. Lu, in 11th IEEE Intersociety Conference on Thermal Thermomechanical Phenomena in Electronic Systems (IEEE, Orlando, FL, 2008), p. 793.

  30. S. Chen and H. Zhang, Silver Sintering and Soldering: Bonding Process and Comparison, ed. by K.S. Siow (Springer, Cham, 2019), p. 1.

  31. K. Suganuma and J. Jiu, in Advanced Bonding Technology Based on Nano-and Micro-metal Pastes, ed. by D. Lu, Wong C.P. (Springer, Cham, 2017), p. 589.

  32. M. Wang, Y. Mei, X. Li, R. Burgos, D. Boroyevich, and G.-Q. Lu, Mater. Lett. 228, 327 (2018).

    Article  Google Scholar 

  33. A. Masson, C. Buttay, H. Morel, C. Raynaud, S. Hascoet, and L. Gremillard, in Proceedings 14th European Conference Power Electronics Applcations (Birmingham, IEEE, 2011), p. 1.

  34. R. Khazaka, B. Thollin, L. Mendizabal, D. Henry, R. Khazaka, and R. Hanna, IEEE Trans. Dev. Mat. Rel. 15, 149 (2015).

    Article  Google Scholar 

  35. G.-Q. Lu, J.N. Calata, G. Lei, and X. Chen, in Proceedings International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (London, IEEE, 2007), p. 1.

  36. H. Zheng, K.D. Ngo, and G.-Q. Lu, IEEE Trans. Dev. Mat. Rel. 15, 214 (2015).

    Article  Google Scholar 

  37. J. Dai, J. Li, P. Agyakwa, M. Corfield, and C.M. Johnson, IEEE Trans. Dev. Mat. Rel. 18, 256 (2018).

    Article  Google Scholar 

  38. I. Platzman, R. Brener, H. Haick, and R. Tannenbaum, J. Phys. Chem. C 112, 1101 (2008).

    Article  Google Scholar 

  39. M. O’reilly, X. Jiang, J. Beechinor, S. Lynch, C. NiDheasuna, J. Patterson, and G. Crean, Appl. Surf. Sci. 91, 152 (1995).

    Article  Google Scholar 

  40. S. Paknejad, G. Dumas, G. West, G. Lewis, and S. Mannan, J. Alloy Comp. 617, 994 (2014).

    Article  Google Scholar 

  41. F. Yu, R.W. Johnson, and M.C. Hamilton, IEEE Trans. Comp. Packg. Manuf. Tech. 5, 1258 (2015).

    Article  Google Scholar 

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Acknowledgements

We acknowledge financial support for this work from Universiti Kebangsaan Malaysia Research Grant GUP-2017 055, “Production of Metallic Conducting Nanowires for Industrial Applications”.

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  1. Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600, Bangi, Selangor, Malaysia

    K. S. Siow & S. T. Chua

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  1. K. S. Siow
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Correspondence to K. S. Siow.

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Siow, K.S., Chua, S.T. Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material. JOM 71, 3066–3075 (2019). https://doi.org/10.1007/s11837-019-03461-4

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