Abstract
Printed circuit boards (PCBs) are essential components of electronic equipments which contain various metallic values. This paper reports a hydrometallurgical recycling process for waste PCBs, which consists of the novel pretreatment consisting of organic swelling of PCBs followed by sulfuric acid leaching of metals from waste PCBs. To recycle the waste PCBs, experiments were carried out for the recovery of copper from the crushed and organic swelled materials of waste PCBs using sulfuric acid leaching in presence of hydrogen peroxide under atmospheric and pressure condition. The leaching of PCBs at 90°C, pulp density 100 g/L under atmospheric condition, using 6M sulfuric acid resulted in the dissolution of a minor amount of copper due to the presence of plastic coating on the surface of metallic layers. On the other hand, when the liberated metal sheets from organic swelled PCBs were treated with dilute sulfuric acid of concentration 2M along with hydrogen peroxide in an autoclave under oxygen atmosphere, the percentage recovery of copper was found to increase from 59.63% to 97.01% with an increase in hydrogen peroxide concentration from 5 to 15% (v/v) keeping constant pulp density 30 g/L.
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References
M.K. Jha and J.-C. Lee, J. Metallurgy and Materials Science, 48(3) (2006), pp. 117–128.
N.K. Kamat, “Challenges of E-waste Management” in www.navhindtimes.in/panorama/challengesewaste-management.
C.-H. Lee et al., J. Hazard Mater., 114B (2004), pp. 93–100.
M.K. Jha et al., Minerals & Metals Review (May 2010), pp. 50–53.
Y.C. Chien et al., Water Resources, 34(17) (2000), pp. 4279–4283.
J.E. Hoffmann, JOM, 43(8) (1991), pp. 48–50.
M.K. Jha et al., Resource Conserv. Recy., 33(1) (2001), pp. 1–22.
M.K. Jha et al., Ind. Eng. Chem., 43(5) (2004), pp. 1284–1295.
M.-S. Kim et al., J. Korean Institute of Resources Recycling, 14(5) (2005), pp. 45–53.
E.-Y. Kim et al., J. Korean Institute of Resources Recycling, 15(6) (2006), pp. 33–40.
E.-Y. Kim, M.-S. Kim, J.-C. Lee, and J.-K. Jung, EPD Congress 2006, ed. S. Howard et al. (Warrendale, PA: TMS, 2006), pp. 929–933.
A. Aue, G. Skjutare, H. Reinhardt, and J. Rydberg, Proceedings of ISEC 1971: International Solvent Extraction Conference 1971 (London: SCI, 1971), pp. 447–450.
D. Pilone and G.H. Kelsall, Hydrometallurgy 2003, ed. C. Young et al. (Warrendale, PA: TMS, 2003), pp. 1565–1575.
I. Masavetas et al., Global Nest J., 11(2) (2009), pp. 241–247.
M. Baird et al., Handbook of Solvent Extraction (New York: Wiley, 1983).
M.S. Alam et al., Hydrometallurgy, 87 (2007), pp. 36–44.
K. Koyama, M. Tanaka, and J.-C. Lee, Hydrometallurgy 2003, ed. C. Young et al. (Warrendale, PA: TMS, 2003), pp. 1555–1563.
J.-C. Lee et al., South Korea patent, WO/2009/064063 (22 May 2009); and China patent, ZL 200880000610.4, (26 January 2011).
M. Alkan et al., J. Hazard. Mater., 119a (2005), pp. 13–18.
O. Herreros et al., Hydrometallurgy, 51 (1999), pp. 345–357.
O. Herreros et al., Hydrometallurgy, 77 (2005), pp. 183–190.
M. Itagaki et al., Corros. Sci., 38(7) (1996), pp. 1109–1125.
E.-Y. Kim et al., Miner. Eng., 21 (2008), pp. 121–128.
V. Kumar, M. Kumar, D. Bagchi, and M.K. Jha, Proceeding of Int. Symposium of Resource Recycling (South Korea: Resource Recycling R&D Center), pp. 138–143.
K. Koyama et al., Mater. Trans., 47 (2006), pp. 1788–1792.
H. Majima et al., Metall. Trans., 21B (1990), pp. 251–258.
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Jha, M.K., Lee, Jc., Kumari, A. et al. Pressure leaching of metals from waste printed circuit boards using sulfuric acid. JOM 63, 29–32 (2011). https://doi.org/10.1007/s11837-011-0133-z
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DOI: https://doi.org/10.1007/s11837-011-0133-z