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Microstructure, Mechanical Behavior, and Thermal Conductivity of Three-Dimensionally Interconnected Hexagonal Boron Nitride-Reinforced Cu-Ni Composite

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Abstract

A powder metallurgy-based strategy to in situ construct a three-dimensionally interconnected hexagonal boron nitride (3Di-hBN) layers surrounding the grains of Cu-Ni matrix through metal–organic chemical vapor deposition process was utilized to fabricate 3Di-hBN-reinforced Cu0.7-Ni0.3 (3Di hBN-Cu-Ni) composite. The effect of 3Di-hBN on the mechanical properties of 3Di hBN-Cu-Ni composite was assessed by comparing with pure Cu-Ni alloy (without hBN) fabricated via powder metallurgy route under similar processing conditions. Uniaxial tensile investigations showed that 3Di-hBN positively influenced the mechanical properties of 3Di hBN-Cu-Ni composite;  ∼16.3, ∼11.67, and ∼27.9% higher yield strength, UTS, and fracture toughness, respectively, compared to PM Cu-Ni alloy. The overall improved performance of 3Di hBN-Cu-Ni composite was attributed to the formation of 3Di-hBN layers at the interfaces of Cu-Ni grains, which enable the composite to withstand the applied load through the mechanisms of load transfer, dislocation strengthening, and grain refinement. In addition, thermal conductivity of 3Di hBN-Cu-Ni composite was found ∼10% higher than that of pure Cu-Ni alloy.

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Authors and Affiliations

  1. Department of Advanced Materials Engineering, Chosun University, Gwangju, 61452, Republic of Korea

    Zahid Hussain & Byung-Sang Choi

  2. Department of Advanced Materials Engineering, Kookmin University, Seoul, 02707, Republic of Korea

    Haneul Jang & HyunJoo Choi

  3. Micro & Nano Technologies, Inc., Gwangju, 61452, Republic of Korea

    Byung-Sang Choi

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Hussain, Z., Jang, H., Choi, H. et al. Microstructure, Mechanical Behavior, and Thermal Conductivity of Three-Dimensionally Interconnected Hexagonal Boron Nitride-Reinforced Cu-Ni Composite. J. of Materi Eng and Perform 31, 2792–2800 (2022). https://doi.org/10.1007/s11665-021-06450-4

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