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Processing and properties of CVD diamond for thermal management

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Abstract

One of the many remarkable properties of diamond is its thermal conductivity, about five times that of copper and the highest of all known materials. The high thermal conductivity in combination with the relative ease of diamond film growth by chemical vapor deposition process makes the material suitable for many applications such as thermal management in high power electronic circuits. For thermal managements applications, various processing steps are needed for the diamond films, such as the metallization for reliable solder bonding, metallurgical processes for planarizing of the faceted growth surface and removal of fine-grained diamond regions with poor thermal conductivity. This paper will review the properties and processing of diamond films for thermal management applications.

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References

  1. F.P. Bundy, H.T. Hall, H.M. Strong and R.J. Wentorf, Nature 176, 51 (1955).

    Article  CAS  Google Scholar 

  2. J.C. Angus, H.A. Will and W.S. Stanko, J. Appl. Phys. 39, 2915 (1968).

    Article  CAS  Google Scholar 

  3. B.V. Spitsyn, L.L. Bouilov and B.V. Deryagin, J. Cryst. Growth 52, 219 (1981).

    Article  CAS  Google Scholar 

  4. J.E. Graebner, S. Jin, G.W. Kammlott, J.A. Herb and C.F. Gardinier, Nature 359, 401 (1992).

    Article  CAS  Google Scholar 

  5. M. Seal, The Properties of Natural and Synthetic Diamond, ed. J.E. Field, (New York: Academic Press, New York, 1992), Ch. 16, p. 607.

    Google Scholar 

  6. M.N. Yoder, Diamond and Diamond-like Films and Coatings, ed. R.E. Clausing et al., (New York: Plenum Press, 1991, p. 1.

    Google Scholar 

  7. S. Jin, J.E. Graebner, G.W. Kammlott, T.H. Tiefel, S.C. Kosinski, L. Chen and R.A. Fastnacht, Appl. Phys. Lett. 60, 1948 (1992).

    Article  Google Scholar 

  8. S. Jin, J.E. Graebner, T.H. Tiefel, G.W. Kammlott and G.J. Zydzik, Diamond and Related Materials 1, 949 (1992).

    Article  CAS  Google Scholar 

  9. S. Jin, J.E. Graebner, M. McCormack, T.H. Tiefel, A. Katz and W.C. Dautremont-Smith, Nature 362, 822 (1993).

    Article  CAS  Google Scholar 

  10. S. Jin, L.H. Chen, J.E. Graebner, M. McCormack and M. Reiss, Appl. Phys. Lett. 63, 622 (1983).

    Article  Google Scholar 

  11. S. Jin, W. Zhu and J.E. Graebner, Applications of Diamond Films and Related Materials, ed. A. Feldman, et al., (Gaithersburg, MD: NIST Special Publication 885, 1995), p. 209.

    Google Scholar 

  12. M. McCormack, S. Jin, J.E. Graebner, T.H. Tiefel and G.W. Kammlott, Diamond and Related Materials 3, 254 (1994).

    Article  CAS  Google Scholar 

  13. Binary Alloy Phase Diagrams, ed. T.B. Massalski, 2nd Ed., (Metals Park, OH: ASM International, 1991), p. 843.

    Google Scholar 

  14. Binary Alloy Phase Diagrams, ed. T.B. Massalski, 2nd Ed., (Metals Park, OH: ASM International, 1991), p. 860.

    Google Scholar 

  15. Binary Alloy Phase Diagrams, ed. T.B. Massalski, 2nd Ed., (Metals Park, OH: ASM International, 1991), p. 834.

    Google Scholar 

  16. A. Katz, K.W. Wang, F.A. Baiocchi, W.C. Dautremont-Smith, E. Lane, H.S. Luftman, R.R. Varma and H. Curnan, Mater. Chemistry and Phys. 33, 281 (1993).

    Article  CAS  Google Scholar 

  17. R. Schaefer, R. Eden and T. Moravec, Norton Diamond (private communication).

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Jin, S., Mavoori, H. Processing and properties of CVD diamond for thermal management. J. Electron. Mater. 27, 1148–1153 (1998). https://doi.org/10.1007/s11664-998-0063-x

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  • DOI: https://doi.org/10.1007/s11664-998-0063-x

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