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Facile, Low-Cost, UV-Curing Approach to Prepare Highly Conductive Composites for Flexible Electronics Applications

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Abstract

We present a facile approach to prepare high-performance ultraviolet (UV)-curable polyurethane–acrylate-based flexible electrical conductive adhesive (PUA-FECA) for flexible electronics applications. PUA is employed as the polymer matrix so that the ECA is flexible and UV-curable at room temperature in just a few minutes. The effects of the PUA-FECA formulation and curing procedure on the electrical properties have been studied. Very low volume resistivity (5.08 × 10−4 Ω cm) is obtained by incorporating 70 wt.% microsized Ag-coated Cu flakes. Moreover, by simply standing the PUA-FECA paste for 4 h before exposure to UV light, the bulk resistivity of the PUA-FECA is dramatically decreased to 3.62 × 10−4 Ω cm. This can be attributed to rearrangement of Ag-coated Cu flakes in the matrix while standing. PUA-FECA also presents stable electrical conductivity during rolling and compression, excellent adhesion, and good processability, making it easily scalable to large-scale fabrication and enabling screen-printing on various low-cost flexible substrates such as office paper and polyethylene terephthalate film.

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Authors and Affiliations

  1. College of Materials Science and Engineering, Key Lab of Guangdong Province for High Property and Functional Macromolecular Materials, South China University of Technology, Guangzhou, 510641, People’s Republic of China

    Fucheng Li, Shilong Chen, Yong Wei, Konghua Liu,  Yong Lin & Lan Liu

Authors
  1. Fucheng Li
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  2. Shilong Chen
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  3. Yong Wei
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  4. Konghua Liu
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  5. Yong Lin
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  6. Lan Liu
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Correspondence to Lan Liu.

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Li, F., Chen, S., Wei, Y. et al. Facile, Low-Cost, UV-Curing Approach to Prepare Highly Conductive Composites for Flexible Electronics Applications. J. Electron. Mater. 45, 3603–3611 (2016). https://doi.org/10.1007/s11664-016-4525-2

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  • DOI: https://doi.org/10.1007/s11664-016-4525-2

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