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Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints

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Abstract

Electromigration (EM), creep, and thermal fatigue (TF) are the most important aspects of the reliability of electronic solder joints, the failure mechanisms of which used to be investigated separately. However, current, mechanical loading, and temperature fluctuation usually co-exist under real service conditions, especially as the magnitude of current density is increasing with joint miniaturization. The importance of EM can no longer be simply ignored when analyzing the creep and TF behavior of a solder joint. The published literature reports that current density substantially changes creep rate, but the intrinsic mechanism is still unclear. Hence, the purpose of this study was to investigate the effects of EM on the creep and TF behavior of Sn58Bi solder joints by analyzing the evolution of electrical resistance and microstructure. The results indicated that EM shortens the lifetime of creep or TF of Sn58Bi solder joints. During creep, EM delays or suppresses the cracking and deforming process, so fracture occurs at the cathode interface. During TF, EM suppresses the cracking process and changes the interfacial structure.

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Acknowledgements

The authors acknowledge support of this work by the Beijing Municipal Natural Science Foundation (2122004) and the National Natural Science Foundation of China (51301007).

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Authors and Affiliations

  1. College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, People’s Republic of China

    Yong Zuo, Limin Ma, Fu Guo, Lei Qiao & Yutian Shu

  2. Chemical Engineering and Materials Science, Michigan State University, Michigan, 48824, People’s Republic of China

    Andree Lee & K. N. Subramanian

Authors
  1. Yong Zuo
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  2. Limin Ma
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  3. Fu Guo
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  4. Lei Qiao
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  5. Yutian Shu
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  6. Andree Lee
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  7. K. N. Subramanian
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Correspondence to Limin Ma or Fu Guo.

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Zuo, Y., Ma, L., Guo, F. et al. Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints. J. Electron. Mater. 43, 4395–4405 (2014). https://doi.org/10.1007/s11664-014-3345-5

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  • DOI: https://doi.org/10.1007/s11664-014-3345-5

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