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Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints

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The effect of the gap size on the shear strength of a solder joint was investigated in both Sn/Cu and Sn/FeNi lap solder joints by varying the gap size from 20 μm to 300 μm. In the Sn/FeNi joints, the shear strength remained relatively constant, around 14 MPa, independent of the gap size. In contrast, the shear strength of the Sn/Cu joint decreased about 20% from 25 MPa to 20 MPa. The decrease was shown to result from Cu6Sn5 precipitation in the thicker Sn/Cu joint, which was absent in the thinner joints.

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Authors and Affiliations

  1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China

    Cai Chen, Lei Zhang, Jiaxi Zhao, Lihua Cao & J. K. Shang

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  1. Cai Chen
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  2. Lei Zhang
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  3. Jiaxi Zhao
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  4. Lihua Cao
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  5. J. K. Shang
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Correspondence to Lei Zhang.

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Chen, C., Zhang, L., Zhao, J. et al. Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints. J. Electron. Mater. 41, 2487–2494 (2012). https://doi.org/10.1007/s11664-012-2156-9

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  • DOI: https://doi.org/10.1007/s11664-012-2156-9

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