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Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints

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Abstract

The effects of the joining sequence on the interfacial reactions and substrate dissolution behaviors in Ni/solder/Cu joints were studied by using 500-μm (diameter) Sn-3.5Ag solder balls and substrates with a 375-μm (diameter) opening. Three distinct paths for the joining sequence were studied. In path I, a solder ball was first joined to the Cu substrate and then to the Ni substrate. In path II, a solder ball was joined to both the Cu and Ni substrates simultaneously. Path III had the opposite joining sequence to path I. The results of this study indicated that (Cu,Ni)6Sn5 was the predominant reaction product at both the Ni/solder and solder/Cu interfaces regardless of the joining sequence. However, the composition, morphology, and thickness of the (Cu,Ni)6Sn5 varied considerably with the different paths. The dissolution behaviors of Cu and Ni were also different. Dybkov’s dissolution kinetics and Cu-Ni-Sn isotherm data were utilized to rationalize these differences.

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Authors and Affiliations

  1. Department of Chemical Engineering & Materials Science, Yuan Ze University, Jhongli, Taoyuan, Taiwan, R.O.C

    Chao Sheng Liu & Cheng En Ho

  2. Taiwan Uyemura Co., Ltd., Dayuan, Taoyuan, Taiwan, R.O.C

    Cheng Sam Peng

  3. Department of Materials Science & Engineering, National Taiwan University, Taipei, Taiwan, R.O.C

    C. Robert Kao

Authors
  1. Chao Sheng Liu
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  2. Cheng En Ho
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  3. Cheng Sam Peng
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  4. C. Robert Kao
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Correspondence to Cheng En Ho.

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Liu, C.S., Ho, C.E., Peng, C.S. et al. Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints. J. Electron. Mater. 40, 1912–1920 (2011). https://doi.org/10.1007/s11664-011-1666-1

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  • DOI: https://doi.org/10.1007/s11664-011-1666-1

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