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Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles

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In the present work, the creep strain of the composite solder joint is measured using a stepped load creep test on a single specimen. Based on the creep strain tests, constitutive relations for the steady-state creep rate are determined for the Ag-particle-reinforced Sn-0.7Cu-based composite solder joint. In addition, creep strain tests on the Sn-0.7Cu solder joint are performed as a comparison. It is found that the activation energy of the Ag-particle-reinforced Sn-0.7Cu-based composite solder joint is higher than that of the Sn-0.7Cu solder joint. At the same time, the stress exponent of the Ag-particle-reinforced Sn-0.7Cu-based composite solder joint is higher than that of the Sn-0.7Cu solder joint. It is expected that the creep resistance of the Ag-particle-reinforced Sn-0.7Cu-based composite solder joint will be superior to that of the Sn-0.7Cu solder joint. Finally, the creep deformation mechanisms of the solder joint are discussed.

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Acknowledgements

The authors greatly appreciate the financial support from the Key Program of the Department of Science and Technology of China (2006BAE03B02), the National Natural Science Foundation (50871004), and the Beijing Natural Science Foundation (2082003). The authors also wish to thank Dr. J.Z. Chen, Shell Global Solutions, Houston, for proofreading the manuscript.

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  1. School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing, 100022, China

    Yaowu Shi, Yanfu Yan, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo & Xiaoyan Li

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  1. Yaowu Shi
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  2. Yanfu Yan
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  3. Jianping Liu
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Correspondence to Yaowu Shi.

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Shi, Y., Yan, Y., Liu, J. et al. Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles. J. Electron. Mater. 38, 1866–1873 (2009). https://doi.org/10.1007/s11664-009-0840-1

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