Abstract
The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90°C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the Inrich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems.
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References
Z. Mei, R. Hansen, M.C. Shine and J.W. Morris, Jr., J. Electron. Packaging 113, 109 (1991).
D. Grivas, K.L. Murty and J.W. Morris, Jr., Acta Met. 27, 731 (1979).
H.E. Cline and T.H. Alden, Trans. AIME 239, 710 (1967).
Z. Mei and J.W. Morris, Jr., J. Electronic Mater. 21, 599 (1992).
Z. Mei, J.W. Morris, Jr., M.C. Shine and T.S.E. Summers, J. Electron. Mater. 20, 599 (1991).
Z. Mei and J.W. Morris, Jr., ASME Winter Meeting, Atlanta, Georgia (1991).
J.C. Wei, Ph.D Thesis, Stanford University, (1981).
R. Darveaux, and I. Turlick, IEEE Trans. on Components, Hybrids and Manu. Tech. 13, 929, December (1990).
J.L. Freer Goldstein and J.W. Morris, Jr., Metall. Trans. A 25A, 2715 (1994).
F. Bartels, H.L. Reynolds and J.W. Morris, Jr., unpublished work.
J.L.F. Goldstein, Ph.D. Thesis, University of California at Berkeley, (1993); and J.W. Morris, Jr., J.L. Freer Goldstein and Z. Mei, JOM 45, 25 (1993).
J.E. Bird, A.J. Mukherjee and J.E. Dorn, Quantitative Relation Between Properties and Microstructure, (Israel University Press, 1969), p. 255.
J.W. Morris, Jr., J.L. Freer Goldstein and Z. Mei, The Mechanics of Solder Alloy Interconnects, ed. S.N. Burchett, D.R. Frear, H.S. Morgan and J.H. Lau, (New York: Van Nostrand Reinhold, 1993).
R.E. Frenkel, M.S. Thesis, University of California, Berkeley, (1954).
J.E. Dorn, Creep and Recovery, (Materials Park, OH: ASM Intl., 1957), p. 255.
J. Weertman, Trans. AIME 218, 207 (1960).
R. Darveaux, E. Yung, I. Turlik and K.L. Murty, Mater. Res. Soc. Symp. Proc., 203, (Pittsburgh, PA: Mater. Res. Soc., 1991), p. 443.
F. Garofalo, Trans. AIME 227, 351 (1963).
C.M. Sellars and W.J. McG. Tegart, Mem. Sci. Rev. Met. 63, 731 (1966).
W.A. Wong and J.J. Jonas, Trans. AIME 242, 2271 (1968).
H.J. Frost and M.F. Ashby, Deformation-Mechanism Maps: The Plasticity and Creep of Metals and Ceramics, (New York: Pergamon Press, 1982).
Z. Mei and J.W. Morris, Jr., J. Electron. Mater. 21, 401 (1992).
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Reynolds, H.L., Kang, S.H. & Morris, J.W. The creep behavior of In-Ag eutectic solder joints. J. Electron. Mater. 28, 69–75 (1999). https://doi.org/10.1007/s11664-999-0197-5
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DOI: https://doi.org/10.1007/s11664-999-0197-5