Abstract
The microstructure of powders that are applicable for electronic materials were studied for some systems in which there is a liquid miscibility gap. The characteristic morphologies of an egg-like core type and a uniform second-phase dispersion are shown in relation to the phase diagram, where thermodynamic calculations are a powerful tool for alloy design and the prediction of microstructure. Typical examples of microstructural evolution and properties of Pb-free solders and Ag-based micropowders with high electrical conductivity produced by a gas-atomizing method are presented.
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Ohnuma, I., Saegusa, T., Takaku, Y. et al. Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap. J. Electron. Mater. 38, 2–9 (2009). https://doi.org/10.1007/s11664-008-0537-x
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DOI: https://doi.org/10.1007/s11664-008-0537-x