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Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders

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The creep behavior of Sn-1Ag-0.5Cu, Sn-2.5Ag-1Cu and Sn-4Ag-0.5Cu ball grid array (BGA) solder balls and 99.99% pure polycrystalline bulk Sn was studied using impression creep and related to the microstructure. Sn-Ag-Cu solders generally consist of primary dendrites/grains of β-Sn, and a eutectic microconstituent comprising fine Ag3Sn and Cu6Sn5 particles in β phase. With increasing concentrations of Ag and Cu in the alloy, the proportion of the eutectic microconstituent in relation to the primary β phase increases. In pure Sn and Sn-1Ag-0.5Cu, the β grains form the continuous matrix, whereas in Sn-2.5Ag-1Cu and Sn-4Ag-0.5Cu, the eutectic microconstituent forms a continuous network around the β grains, which form isolated islands within the eutectic. The steady-state creep behavior of the alloys was dominated by the response of the continuous microstructural constituent (β-Sn or solid solution β for pure Sn and Sn-1Ag-0.5Cu, and the eutectic microconstituent for Sn-2.5Ag-0.5Cu and Sn-4Ag-0.5Cu). In general, the steady-state creep rate decreased with increasing alloy content, and in particular, the volume fraction of Ag3Sn and Cu6Sn5 precipitates. The rate-limiting creep mechanism in all the materials investigated here was core diffusion controlled dislocation climb. However, subtle changes in the stress exponent n and activation energy Q were observed. Pure Sn shows n = 5, Q = 42 kJ/mol, Sn-1Ag-0.5Cu shows n = 5, Q = 61 kJ/mol, whereas both Sn-2.5Ag-1Cu and Sn-4Ag-0.5Cu show n = 6 and Q = 61 kJ/mol. Rationalizations for the observed changes of n and Q are provided, based on the influence of the microstructure and the solute concentrations.

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Acknowledgements

This work was supported by NSF Grant DMR-0209464 and SRC Contract 2006-NJ-1394. The authors are grateful to S. Jadhav of INTEL for supplying the BGA samples with varying compositions.

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  1. Department of Mechanical and Astronautical Engineering, Center for Materials Science and Engineering, Naval Postgraduate School, Monterey, CA, 93943, USA

    T. Chen & I. Dutta

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  1. T. Chen
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  2. I. Dutta
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Correspondence to I. Dutta.

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Chen, T., Dutta, I. Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders. J. Electron. Mater. 37, 347–354 (2008). https://doi.org/10.1007/s11664-007-0340-0

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