Since Au is used as the end finish on Pd preplated leadframes (Pd PPFs), the weak adhesion between the surface noble metal Au and the epoxy molding compound (EMC) often causes delamination and reduces the reliability of integrated circuit (IC) packages, which greatly limits the application of Pd PPFs. This paper reports on a novel application of arrays of nanocones prepared by a special electrodeposition method to improve the adhesion between the leadframe and EMC. Nanocone-arrayed structures greatly increase the area of the interface between the Pd PPF and the EMC. Shearing strength tests indicate that the adhesion between the EMC and nanocone-arrayed PPF is three to four times higher than that of the conventional PPF. Apart from increased interfacial area, the effect of a physical inlay may also increase the adhesion strength.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
S.C. Park, C. Cho, and S.K. Paek, Electronics Manufacturing Technology Symposium, 2003 (IEMT 2003, IEEE/CPMT/SEMI 28th International IEEE Publisher 2003), pp. 31–37
A. Fujii, M. Andoh, I. Yamamoto, H. Ibuki, K. Uchida, A.␣Yoshizumi, Electronics Manufacturing Technology Symposium, 1998 (23rd IEEE/CPMT, IEEE Publisher 1998), pp. 478–491
J. Park, Y. Kim, S.W. Wang, S.W. Lee, H. Jeon (2006) IEEE Trans. Dev. Mater. Reliab. 6(1): 33
K. Cho, E.C. Cho, Adhes. Sci. Technol. 14(11), 1333 (2000)
D. Abbott, T. Ahsan, A. Gallo, and C. Bischof, Proceedings of IPCSMEM Council APEX 2001, LF2-1 ( Essex: APEX Publisher 2001), pp. 1–11
Y. Sung, J. Kim, C. Yue, J. Hsieh, J. Adhes. 73, 1 (2000)
R. Walberg and S. Liou, Electronic Packaging Reliability, Vol. 6. (ASME, 1993), pp. 55–59
W.H. Zhu, P.J. Durben, B.J. Tatarchuk, J. Power Sources 111, 221 (2002)
I.J. Brown, D. Clift, S. Sotiropoulos, Mater. Res. Bull. 34, 1055 (1999)
G.Y. Zhang, X. Jiang, E.G. Wang, Science 300, 472 (2003)
N. Muradov, A. Schwitter, Nano Lett. 2, 673 (2002)
M. Terauchi, M. Tanaka, K. Suzuki, A. Ogino, K. Kimura, Chem. Phys. Lett. 324, 359 (2000)
Z.S. Wu, S.Z. Deng, N.S. Xu, J. Chen, J. Zhou, J. Chen, Appl. Phys. Lett. 80, 3829 (2002)
Y.B. Li, Y. Bando, D. Golberg, Appl. Phys. Lett. 84, 3603 (2004)
L.D. Karpov, A.P. Genelev, Y.V. Mirgorodski, and A.N. Tikhonski, The 9th International Vacuum Microelectronics Conference, St. Petersburg (IEEE Publisher 1996), p. 542
S.P. Davis, M.R. Prausnitz, M.G. Allen, The 12th International Conference on Solid State Sensors. Actuators and Microsystems, Boston, 2003), p. 1435
Acknowledgements
We would like to thank the Analytical and Testing Center of Shanghai Jiao Tong University for helping with the SEM inspection, and gratefully acknowledge the financial support of the National Natural Science foundation of China (No. 90406013) and Shanghai Pujiang Program (No. 05PJ14065).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Hang, T., Ling, H., Xiu, Z. et al. Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed Pd Preplated Leadframes. J. Electron. Mater. 36, 1594–1598 (2007). https://doi.org/10.1007/s11664-007-0292-4
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-007-0292-4