Abstract
Electronic components used in electronic gadgets are becoming increasingly thin, tiny, and miniature. The assembly of miniaturized components requires an enhanced joining technique and reliable soldering material for the tiny solder junction. However, sophisticated assembly procedures for tiny components using nano-reinforced solder paste on real surface mount devices continue to be a significant research gap. Thus, the purpose of this work is to evaluate the advanced joining of ultra-fine packages utilizing nano-reinforced solder paste following reflow soldering. TiO2, Fe2O3, and NiO nanoparticles (with 0.01 wt.%, 0.05 wt.%, and 0.15 wt.%) were chosen to reinforce lead-free solder paste (SAC 305 type 5) to create three samples with varying nanoparticle types. The samples were then assembled using a reflow soldering process. The performance nano-reinforced solder paste was compared to a pure SAC305 solder paste in terms of material and mechanical properties. Various experimental techniques were used to characterize the microstructure, fillet height, and hardness. The experimental results show that the presence of nanoparticles improves the material and structural integrity of the ultra-fine solder joint in general. By adding 0.15 wt percent TiO2, Fe2O3, and NiO, the average hardness of SAC305 increased by 77%, 86%, and 67%, respectively. It also improves the fillet height above 90 µm for TiO2, Fe2O3, and NiO, which meet the international IPC standards for reliability. This research gives engineers a detail insight on the performance of the nano-reinforced solder joint for a miniaturized package in the microelectronics industry. The findings are expected to provide a proper guideline and reference for the manufacture of miniaturized electronic packages. The findings are expected to serve as an appropriate reference and guidance for the manufacturing of compact electronic packages.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Similar content being viewed by others
References
Chang, S. Y., Jain, C. C., Chuang, T. H., et al. (2011). Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder. Materials and Design, 32, 4720–4727. https://doi.org/10.1016/j.matdes.2011.06.044
Che Ani, F., Jalar, A., Saad, A. A., et al. (2018a). The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly. International Journal of Advanced Manufacturing Technology, 96, 717–733. https://doi.org/10.1007/s00170-018-1583-z
Che Ani, F., Jalar, A., Saad, A. A., et al. (2018b). SAC–xTiO 2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly. Soldering & Surface Mount Technology, 30, 1–13. https://doi.org/10.1108/SSMT-04-2017-0011
Che Ani, F., Jalar, A., Saad, A. A., et al. (2019). Characterization of SAC—x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly. Soldering & Surface Mount Technology, 31, 109–124. https://doi.org/10.1108/SSMT-08-2018-0024
Chellvarajoo, S., & Abdullah, M. Z. (2016). Microstructure and mechanical properties of Pb-free Sn–3.0Ag–0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process. Materials and Design, 90, 499–507. https://doi.org/10.1016/j.matdes.2015.10.142
Chellvarajoo, S., Abdullah, M. Z., & Khor, C. Y. (2015a). Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process. Materials and Design, 82, 206–215. https://doi.org/10.1016/j.matdes.2015.05.065
Chellvarajoo, S., Abdullah, M. Z., & Samsudin, Z. (2015b). Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process. Materials and Design, 67, 197–208. https://doi.org/10.1016/j.matdes.2014.11.025
Chuang, T. H., Tsao, L. C., Chung, C.-H., & Chang, S. Y. (2012). Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging. Materials and Design, 39, 475–483. https://doi.org/10.1016/j.matdes.2012.03.021
Efzan Mhd Noor, E., & Singh, A. (2014). Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys. Soldering & Surface Mount Technology, 26, 147–161. https://doi.org/10.1108/SSMT-02-2014-0001
Fouzder, T., Shafiq, I., Chan, Y. C., et al. (2011). Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads. Journal of Alloys and Compounds, 509, 1885–1892. https://doi.org/10.1016/j.jallcom.2010.10.081
Gagliano, R., & Fine, M. E. (2001). Growth of η phase scallops and whiskers in liquid tin-solid copper reaction couples. JOM Journal of the Minerals Metals and Materials Society, 53, 33–38. https://doi.org/10.1007/s11837-001-0100-1
Gain, A. K., Chan, Y. C., & Yung, W. K. C. (2011a). Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates. Microelectronics Reliability, 51, 975–984. https://doi.org/10.1016/j.microrel.2011.01.006
Gain, A. K., Chan, Y. C., & Yung, W. K. C. (2011b). Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads. Microelectronics Reliability, 51, 2306–2313. https://doi.org/10.1016/j.microrel.2011.03.042
IPC. (2010a). Requirements for acceptability of electronic assemblies. In IPC-A-610E. Illinois, USA
IPC. (2010b). Requirements for soldered electrical and electronic assemblies. In J-STD-001E Jt. Ind. Standard. Illinois, USA
Laurila, T., Vuorinen, V., & Kivilahti, J. K. (2005). Interfacial reactions between lead-free solders and common base materials. Materials Science and Engineering R: Reports, 49, 1–60. https://doi.org/10.1016/j.mser.2005.03.001
Lea, C. (1988). A scientific guide to surface mount technology. Electrochemical Publications.
Lee, N.-C. (2002). Reflow soldering process and troubleshooting: SMT, BGA, CSP and flip chip technologies. Newnes.
Liu, P., Yao, P., & Liu, J. (2008). Effect of SiC nanoparticle additions on microstructure and microhardness of Sn-Ag-Cu solder alloy. Journal of Electronic Materials, 37, 874–879. https://doi.org/10.1007/s11664-007-0366-3
Mokhtari, O., Roshanghias, A., Ashayer, R., et al. (2012). Disabling of nanoparticle effects at increased temperature in nanocomposite solders. Journal of Electronic Materials, 41, 1907–1914. https://doi.org/10.1007/s11664-012-1976-y
Oliver, W. C., & Pharr, G. M. (2004). Measurement of hardness and elastic modulus by instrumented indentation: Advances in understanding and refinements to methodology. Journal of Materials Research, 19, 3–20.
Seo, S.-K., Kang, S. K., Shih, D.-Y., & Lee, H. M. (2009a). An investigation of microstructure and microhardness of Sn-Cu and Sn-Ag solders as functions of alloy composition and cooling rate. Journal of Electronic Materials, 38, 257–265. https://doi.org/10.1007/s11664-008-0545-x
Seo, S.-K., Kang, S. K., Shih, D.-Y., & Lee, H. M. (2009b). The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging. Microelectronics Reliability, 49, 288–295. https://doi.org/10.1016/j.microrel.2008.11.014
Tang, Y., Li, G. Y., & Pan, Y. C. (2013). Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints in reflow process. Journal of Alloys and Compounds, 554, 195–203. https://doi.org/10.1016/j.jallcom.2012.12.019
Tay, S. L., Haseeb, A. S. M. A., Johan, M. R., et al. (2013). Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate. Intermetallics, 33, 8–15. https://doi.org/10.1016/j.intermet.2012.09.016
Tsao, L. C., Chang, S. Y., Lee, C. I., et al. (2010). Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder. Materials and Design, 31, 4831–4835. https://doi.org/10.1016/j.matdes.2010.04.033
Wassink, R., & Verguld, M. (1995). Manufacturing techniques for surface mounted assemblies. Electrochemical Publications.
Wiese, S., & Wolter, K.-J. (2004). Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders. Microelectronics Reliability, 44, 1923–1931. https://doi.org/10.1016/j.microrel.2004.04.016
Xu, S., Chan, Y. C., Zhang, K., & Yung, K. C. (2014). Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing. Journal of Alloys and Compounds, 595, 92–102. https://doi.org/10.1016/j.jallcom.2014.01.083
Yunus, M., Srihari, K., Pitarresi, J. M., & Primavera, A. (2003). Effect of voids on the reliability of BGA/CSP solder joints. Microelectronics Reliability, 43, 2077–2086. https://doi.org/10.1016/S0026-2714(03)00124-0
Acknowledgements
The authors would like to thank the Universiti Sains Malaysia through Research University Grant (1001.PMEKANIK.8014607), Universiti Kebangsaan Malaysia (Research grant–DIP-2014-012) and Jabil Circuit Sdn Bhd for their financial support. The authors wish to extend their appreciation to Prof. Ir. Dr. M.Z. Abdullah, Mr. Z. Samsudin and Mr. M.Y. Tura Ali for their technical support.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2022 The Author(s), under exclusive license to Springer Nature Switzerland AG
About this chapter
Cite this chapter
Ani, F.C., Saad, A.A., Jalar, A., Khor, C.Y., Abas, M.A., Bachok, Z. (2022). Advanced Assembly of Miniaturized Surface Mount Technology Components Using Nano-reinforced Solder Paste. In: Salleh, M.A.A.M., Abdul Aziz, M.S., Jalar, A., Izwan Ramli, M.I. (eds) Recent Progress in Lead-Free Solder Technology. Topics in Mining, Metallurgy and Materials Engineering. Springer, Cham. https://doi.org/10.1007/978-3-030-93441-5_6
Download citation
DOI: https://doi.org/10.1007/978-3-030-93441-5_6
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-030-93440-8
Online ISBN: 978-3-030-93441-5
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)