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Sn-Cu Intermetallic Grain Morphology Related to Sn Layer Thickness

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Tin is widely used as a coating material for copper metal in the electronics industry where tin whisker growth is a concern because it affects the reliability of electronic devices. Because whisker growth reduces joint reliability, it is important to monitor the growth of Cu3Sn and Cu6Sn5, which is usually done by using an X-ray diffraction method to estimate the thickness of the tin layer. In this study, we use the sequential electrochemical reduction analysis (SERA) technique to measure the thickness of layers of pure tin, Cu6Sn5, and Cu3Sn. We also discuss the depletion rate of tin layers at high-temperature aging and the growth of these intermetallics.

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References

  1. K.N. Tu, Acta Metall. 21, 347 (1973)

    Article  CAS  Google Scholar 

  2. K.N. Tu, R.D. Thompson, Acta Metall. 30, 947 (1982)

    Article  CAS  Google Scholar 

  3. K.N. Tu, Mater. Chem. Phys. 46, 217 (1996)

    Article  CAS  Google Scholar 

  4. P. Bratin, M. Pavlov, G. Chalyt, Circuit World 25, 59 (1999)

    Article  Google Scholar 

  5. P. Bratin, M. Pavlov, G. Chalyt, Printed Circuit Fabricat. 22, 30 (1999)

    Google Scholar 

  6. P. Bratin, G. Chalyt, F. Hayward, M. Pavlov, Printed Circuit Fabricat. 23, 48 (2000)

    Google Scholar 

  7. R. Schetty, 2004 International Conference on the Business of Electronic Product Reliability and Liability (2004), p. 29

  8. S.V. Sattiraju, B. Dang, R.W. Johnson, Y. Li, J.S. Smith, M.J. Bozack, IEEE Trans. Electron. Packag. Manuf. 25, 168 (2002)

    Article  CAS  Google Scholar 

  9. S. Cho, J. Yu, S.K. Kang, D.-Y. Shih, J. Electron. Mater. 34, 635 (2005)

    Article  CAS  Google Scholar 

  10. S. Cho, J. Yu, S.K. Kang, D.-Y. Shih, JOM 57, 50 (2005)

    Article  CAS  Google Scholar 

  11. D.M. Tench, M.W. Kendig, D.P. Anderson, D.D. Hillman, G.K. Lucey, T.J. Gher, Solder. Surface Mount Technol. 46, 18 (1993)

    Google Scholar 

  12. D.M. Tench, D.P. Anderson, P. Kim, J. Appl. Electrochem. 24, 18 (1994)

    Article  CAS  Google Scholar 

  13. D.M. Tench and D.P. Anderson, U.S. Patent 5,262,002 (1993)

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Acknowledgements

The authors are pleased to acknowledge the financial support for this research provided by National Science Council, Grant Nos. NSC 95-2221-E-110-030 and 94-2218-E-110-009.

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Authors and Affiliations

  1. Institute of Materials Science and Engineering, National Sun Yat-Sen University, Kaohsiung, Taiwan

    Min-Hsien Lu

  2. Center for Nanoscience and Nanotechnology, National Sun Yat-Sen University, Kaohsiung, Taiwan

    Ker-Chang Hsieh

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  1. Min-Hsien Lu
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  2. Ker-Chang Hsieh
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Correspondence to Ker-Chang Hsieh.

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Lu, MH., Hsieh, KC. Sn-Cu Intermetallic Grain Morphology Related to Sn Layer Thickness. J. Electron. Mater. 36, 1448–1454 (2007). https://doi.org/10.1007/s11664-007-0270-x

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  • DOI: https://doi.org/10.1007/s11664-007-0270-x

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