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Design of Solder Joint Structure for Flip Chip Package with an Optimized Shear Test Method

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Abstract

The structure of flip chip solder bumps was optimized in terms of shear height and shear speed using a shear test method with both experimental investigation and nonlinear, three-dimensional, finite element analysis being conducted. A representative, Pb-free solder composition, Sn-3.0Ag-0.5Cu, was used to optimize the shear test of the flip chip solder joints. Increasing the shear height, at a fixed shear speed, decreased the shear force, as did decreasing the shear speed, at a fixed shear height. These experimental and computational results supported the recommendation of low shear height and low shear speed condition for the shear testing of flip chip solder bumps. This optimized shear test method was applied to investigate the effect of various heights of mini bumps on the shear force of the solder joints. The shear force increased with increasing Ni-P mini bump height.

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References

  1. K. Zeng, K.N. Tu, Mater. Sci. Eng. R 38, 55 (2002)

    Article  Google Scholar 

  2. D.G. Kim, J.W. Kim, S.B. Jung, Mater. Sci. Eng., B 121, 204 (2005)

    Article  Google Scholar 

  3. Y. Lin, W. Liu, Y. Guo, F.G. Shi, IEEE Trans. Adv. Packag. 28, 79 (2005)

    Article  CAS  Google Scholar 

  4. D.S. Liu, C.Y. Ni, C.Y. Chen, Finite Elem. Anal. Des. 39, 661 (2003)

    Article  CAS  Google Scholar 

  5. D.G. Yang, J.S. Liang, Q.Y. Li, L.J. Ernst, G.Q. Zhang, Microelectron. Reliab. 44, 1947 (2004)

    Article  Google Scholar 

  6. J.W. Kim, S.B. Jung, Mater. Sci. Eng. A 371, 267 (2004)

    Article  Google Scholar 

  7. J.W. Kim, S.B. Jung, Mater. Sci. Eng. A 397, 145 (2005)

    Article  Google Scholar 

  8. S.W. Ricky Lee, X. Huang, Solder. Surf. Mt. Technol. 14, 45 (2002)

    Article  Google Scholar 

  9. JESD22-B117, JEDEC Solid State Technology Association (USA), 2000

  10. D.G. Kim, J.W. Kim, J.G. Lee, H. Mori, D.J. Quesnel, S.B. Jung, J. Alloy Compd. 395, 80 (2005)

    Article  CAS  Google Scholar 

  11. M. He, W.H. Lau, G. Qi, Z. Chen, Thin Solid Films 462–463, 376 (2004)

    Article  Google Scholar 

  12. J.W. Kim, D.G. Kim, S.B. Jung, Microelectron. Reliab. 46, 535 (2006)

    Article  CAS  Google Scholar 

  13. H. Sakai, K. Nishimura, M. Motegi, and S. Sakuyama, Proc. 8th Symp. of Microjoining and Assembly Technology in Electronics (Yokohama: JWS, 2002) pp. 443–448

  14. K.C. Chang, K.N. Chiang, IEEE Trans. Compon. Packag. Trans. 27, 373 (2004)

    Article  CAS  Google Scholar 

  15. G.R. Johnson and W.H. Cook, Proc. 7th Int. Symp. on Ballistics (ADPA Hague, 1983), pp. 541–549

  16. F.J. Zerilli, R.W. Armstrong, J. Appl. Phys. 61, 1816 (1987)

    Article  CAS  Google Scholar 

  17. S.R. Bodner, Y.J. Partom, J. Appl. Mech. 42, 385 (1975)

    Google Scholar 

  18. P.S. Symmonds, Behaviour of Materials under Dynamic Loading (New York: ASME, 1965), pp. 106–124

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ACKNOWLEDGEMENT

This work was supported by Grant No. RTI04-03-04 from the Regional Technology Innovation Program of the Ministry of Commerce, Industry and Energy (MOCIE).

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Authors and Affiliations

  1. School of Advanced Materials Science & Engineering, Sungkyunkwan University, Jangan-gu, Suwon, 440-746, South Korea

    Jong-Woong Kim & Seung-Boo Jung

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  1. Jong-Woong Kim
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  2. Seung-Boo Jung
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Correspondence to Seung-Boo Jung.

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Kim, JW., Jung, SB. Design of Solder Joint Structure for Flip Chip Package with an Optimized Shear Test Method. J. Electron. Mater. 36, 690–696 (2007). https://doi.org/10.1007/s11664-007-0140-6

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  • DOI: https://doi.org/10.1007/s11664-007-0140-6

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